Chip packing structure, chip structure and method for forming chip

Abstract

This is a chip packing structure avoiding gel overflow. It includes a supporter, chip and base gel. The chip is of a gel blocking section and installed on the supporter. The blocking section is to one side of the chip, with a top and bottom face in an acute angle. The base gel is in between the supporter and the chip and blocked by the bottom face of the gel blocking section.

Description

technical field [0001] The present invention relates to a chip packaging structure, a chip structure and a chip forming method, and in particular to a chip packaging structure, a chip structure and a chip forming method capable of preventing the primer from creeping. Background technique [0002] In order to reduce the electronic signal transmission distance between the chip and the carrier and reduce the size of the packaged chip package structure, the chip is combined with the carrier in a flip-chip package, such as figure 1 As shown, the conventional chip packaging structure 100 includes a carrier 110 , a chip 120 and a primer 130 . A plurality of connection pads 112 are formed on a surface 111 of the carrier 110 , and the chip 120 is combined on the surface 111 of the carrier 110 in a flip-chip packaging manner. The chip 120 has an active surface 121 and a back surface 122 , the active surface 121 of the chip 120 has several welding pads 123, and several bumps 140 conne...

AI Technical Summary

Problems solved by technology

A plurality of connection pads 112 are formed on a surface 111 of the carrier 110 , and the chip 120 is combined on the surface 111 of the carrier 110 in a flip-chip packaging manner. The chip 120 has an active surface 121 and a back surface 122 , the active surface 121 of the chip 120 has several welding pads 123, and several bumps 140 connect the connection pads 112 on the carrier 110 and the welding pads 123 on the chip 120, the primer 130 is formed on Between the carrier 110 and the chip 120 to protect the bumps 140, however, in the baking step, the viscosity of the primer 130 will decrease and flow along the side of the chip 120 and extend to the side of the chip 120 The back side 122 (this phenomenon is also called glue climbing), thus causing the chip 120 to be polluted

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