Chip packing structure, chip structure and method for forming chip

Abstract

This is a chip packing structure avoiding gel overflow. It includes a supporter, chip and base gel. The chip is of a gel blocking section and installed on the supporter. The blocking section is to one side of the chip, with a top and bottom face in an acute angle. The base gel is in between the supporter and the chip and blocked by the bottom face of the gel blocking section.

Description

technical field [0001] The present invention relates to a chip packaging structure, a chip structure and a chip forming method, and in particular to a chip packaging structure, a chip structure and a chip forming method capable of preventing the primer from creeping. Background technique [0002] In order to reduce the electronic signal transmission distance between the chip and the carrier and reduce the size of the packaged chip package structure, the chip is combined with the carrier in a flip-chip manner. As shown in FIG. 1 , the existing chip package structure 100 includes a carrier device 110, a chip 120 and a primer 130. A plurality of connection pads 112 are formed on a surface 111 of the carrier 110. The chip 120 is combined on the surface 111 of the carrier 110 in a flip-chip manner. The chip 120 has an active surface 121 and a back surface 122. The active surface 121 of 120 has several welding pads 123, and several bumps 140 connect these connection pads 112 on t...

AI Technical Summary

Problems solved by technology

A plurality of connection pads 112 are formed on a surface 111 of the carrier 110. The chip 120 is combined on the surface 111 of the carrier 110 in a flip-chip manner. The chip 120 has an active surface 121 and a back surface 122. The active surface 121 of 120 has several welding pads 123, and several bumps 140 connect these connection pads 112 on the carrier 110 and these welding pads 123 on the chip 120, and the primer 130 is formed on the carrier 110 Between the chip 120 to protect these bumps 140, however, in the baking step, the viscosity of the primer 130 will reduce and flow along the side of the chip 120 and extend to the back 122 of the chip 120 (here Phenomenon is also known as glue climbing), thus causing the chip 120 to be polluted

Images