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Making method for circuit board

A circuit board manufacturing and substrate technology, applied in the fields of printed circuit manufacturing, circuit, printed circuit, etc., can solve problems such as the inability to effectively control the expansion of circuit gaps and the limitation of circuit board precision, and achieve the goal of avoiding the expansion of circuit gaps and slowing down lateral etching Effect

Active Publication Date: 2009-06-03
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] Therefore, the existing circuit board manufacturing method cannot effectively control the problem of the expansion of the line gap
Moreover, since part of the circuit layer with a small width may disappear after lateral etching, the precision of the circuit board is greatly limited

Method used

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  • Making method for circuit board
  • Making method for circuit board
  • Making method for circuit board

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Embodiment Construction

[0025] Relevant detailed description and technical contents of the present invention are as follows now in conjunction with the accompanying drawings:

[0026] Please also refer to image 3 And Fig. 4A~4H, wherein image 3 It is a flow chart of a circuit board manufacturing method according to a preferred embodiment of the present invention, and FIGS. 4A-4H are image 3 Schematic diagram of each step. In this embodiment, the circuit board is used as a package substrate for carrying a chip. However, the manufacturing method of the present invention can also be applied to circuit boards of other uses, and the above uses of the circuit boards are not intended to limit the technical scope of the present invention.

[0027] First, in image 3 In step S1 , as shown in FIG. 4A , a substrate 290 is provided, and the substrate 290 has a plurality of through holes 293 . In this embodiment, the substrate 290 includes a copper layer 291 , an insulating layer 292 and a through hole 29...

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PUM

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Abstract

The utility model relates to a circuit board fabrication method, which comprises the following steps: first, a base plate is provided, and the base plate is provided with a plurality of through holes; then, a first metallic layer is non-electrically electroplated on the surface of the base plate and the surface of the through holes; after that, third, a second metallic layer is electroplated on the first metallic layer; forth, the second metallic layer and the first metallic layer are patterned to form a patterned line layer; finally, a third metallic layer is electroplated on the patterned line layer.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for forming a circuit board with a circuit pattern by two-time electroplating. Background technique [0002] The manufacturing process of semiconductor components is divided into front-end engineering and back-end engineering. The two are bounded by cutting wafers into chips. Before that, it is the front-end project, and after that, it is the back-end project. In the back-end engineering, the chips are packaged to form a package structure. The packaging structure utilizes chip fixing technology and micro-connection technology to arrange, fix and connect chips and other components on a circuit board, lead out pins, and use plastic insulating materials to package and fix them to assemble a complete system. [0003] In the packaging structure, the function of the circuit board is to carry and fix electronic components, and use the circuit pattern formed on its...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H05K3/02
Inventor 曾奇照吕明龙
Owner ADVANCED SEMICON ENG INC