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Composite of non-halogen flame retarded type epoxy resin and semi-solidified sheet containing same composite and copper foil clad laminated board

A technology of epoxy resin and prepreg, which is applied in the direction of layered products, metal layered products, chemical instruments and methods, etc., and can solve problems such as poor flame resistance

Inactive Publication Date: 2009-06-17
DONGGUAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since epoxy resin is a flammable material with poor flame resistance, it has been an important topic for practitioners to carry out flame-retardant modification of epoxy resin and make flame-retardant copper-clad laminates.

Method used

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  • Composite of non-halogen flame retarded type epoxy resin and semi-solidified sheet containing same composite and copper foil clad laminated board
  • Composite of non-halogen flame retarded type epoxy resin and semi-solidified sheet containing same composite and copper foil clad laminated board
  • Composite of non-halogen flame retarded type epoxy resin and semi-solidified sheet containing same composite and copper foil clad laminated board

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Experimental program
Comparison scheme
Effect test

preparation example Construction

[0026] Glycidyl maleopimarate (GMP, Glycidyl maleopimarate) in the halogen-free flame-retardant epoxy resin composition of the present invention, its preparation method comprises: adding maleopimaric acid, epichlorohydrin, water into reaction system and stirring Raise the temperature, add the catalyst, cool down after the reaction, add the solvent, add sodium hydroxide, filter after the reaction, wash the filtrate with water until there are no halogen ions, dry, and remove the solvent under reduced pressure to obtain the product. The epoxy equivalent number of the obtained glycidyl maleopimarate is 210-590, and the glycidyl ester type epoxy resin can be used alone or in combination of two or more.

[0027] The high ortho phenolic epoxy resin in the halogen-free flame retardant epoxy resin composition of the present invention is an epoxy resin obtained by reacting bad oxychloropropane in the high ortho phenolic resin. High ortho phenolic resin is a resin obtained by condensatio...

preparation Embodiment 1

[0037] Add 20 parts by weight (wt) of maleopimaric acid, 25 to 36 parts by weight of epichlorohydrin, and 1.5 to 2.7 parts by weight of water into the reaction system, stir, raise the temperature to 85 to 115°C, and add 0.1 to 0.6 parts by weight of tetramethyl Ammonium chloride catalyst, the reaction time is 5 hours, then cooled to room temperature, add 25 wt parts of toluene, slowly add 7-8 wt parts of sodium hydroxide, control the temperature below 35 ° C, react for 45-60 minutes, filter, and wash the filtrate with water until there is no Halide ions, dried, and the solvent removed under reduced pressure to obtain glycidyl maleopimarate (GMP), the product is light yellow viscous liquid or solid. The number of epoxy equivalents is 210-590. Softening point: 60℃~120℃. Add methyl ethyl ketone to the obtained reaction product to adjust the solid content of the resin to 70wt%. GMP has the following molecular structure:

[0038]

preparation Embodiment 2

[0040] Add phenol and formaldehyde in a ratio of 1:0.85 (mol ratio) into a three-necked flask equipped with a stirrer, a thermometer and a condenser, then add 3‰ of oxalic acid catalyst, and react under reflux for 6 hours, with a dropwise concentration of 6mol / L of hydrochloric acid until the system is milky white, then react for 30 minutes, neutralize with 10wt% NaOH aqueous solution, the resulting resin and water layers, separate the upper layer of water and unreacted reagents by decantation, wash with hot water 5 times, vacuum dehydration, to obtain a light yellow transparent high ortho phenolic resin, the molecular structure of the resin is:

[0041] or

[0042] In the there-necked flask that stirrer, thermometer and condensing pipe are equipped with, add above-mentioned high ortho-position phenolic resin and excess epichlorohydrin (by the hydroxyl mole number that high ortho-position phenolic resin contains: epichlorohydrin mole number= 1:5), quaternary ammonium sal...

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PUM

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Abstract

The invention relates to a modified epoxy resin compounding that is non-halogen and non-antimon inflaming retarding compounding and the semi-solidified sheet, copper clad laminate made from the compounding. It mainly contains bisphenol A type epoxy resin, maleopimaric acid glycidol ester, high ortho position phenolic aldehyde epoxy resin, phenol-formaldehyde resin inflaming retarding solidifying agent, co-inflaming retarding accelerating agent, solidifying agent and inorganic filling material. The copper clad laminate has no pollution and safety. The firing capability reaches UL94 V-0 grade, CTT is over 600V, and thermal endurance could be no delamination and no bubble.

Description

technical field [0001] The invention relates to a modified epoxy resin composition, that is, a halogen-free flame-retardant composition, and a prepreg and a copper-clad laminate prepared from the resin composition as a base material. Background technique [0002] Epoxy resins are widely used in various industries because of their excellent electrical and mechanical properties, and are widely used in the electronics industry in the field of copper-clad laminates (CCL) for printed circuit boards (PCBs). However, since epoxy resin is a flammable material with poor flame resistance, it has been an important topic for practitioners to carry out flame-retardant modification of epoxy resin and produce flame-retardant copper-clad laminates. [0003] As we all know, halogen flame retardants have been used in printed circuit substrates for many years, and the flame retardancy of traditional copper clad laminates has always relied on halogens (mainly bromine) and their synergists - ant...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08L63/04C08K5/521C08J5/24B32B15/092
Inventor 刘治猛刘煜平蒋欣
Owner DONGGUAN UNIV OF TECH