Method for preparing three-dimensional micro-configuration of unidimensional nanometer material

A nanomaterial and microstructure technology, which is applied in the field of preparation in the field of nanotechnology, can solve the problems of inability to prepare three-dimensional microstructures, and it is difficult to achieve the mass production capacity of semiconductor manufacturing technology, and achieves low cost, easy mass production, and operability. strong effect

Inactive Publication Date: 2009-07-22
SHANGHAI JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The three-dimensional structure formed by this method is formed on the carbon nanotube array, so there are process compatibility problems with other parts of the electronic device, such as metal film, dielectric film and other functional corresponding structures, and it is difficult to achieve it by laser processing. Mass production capability of semiconductor manufacturing technology
Since both methods are processed on the CVD-grown carbon nanotube layer, the height of the obtained three-dimensional microstructure is limited by the thickness of the CVD growth film, and it is impossible to prepare a large-height three-dimensional microstructure.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] (1) preparation of the substrate, the substrate used in the present embodiment is 3 inches in diameter, the glass that thickness is 1.2 millimeters, at first adopts sputtering method to form the metal composite film of chromium and copper on the substrate, the thickness of chromium is 0.03 Micron, the thickness of copper is 0.07 micron.

[0017] (2) Metal micro-electroforming: Firstly, photoresist micro-casting, using the semiconductor photolithography process, including four steps of removing glue, drying glue, exposing and developing. Adopt positive photoresist in the present embodiment, throw away glue-baking glue twice on the glue throwing machine, form the photoresist layer of 70 micron thickness, then use 275 watts of mercury lamps to expose-develop twice, each exposure time is 5 minutes, the development time is 5 minutes. After development, a 70 micron thick photoresist mold pattern was formed.

[0018] The electroforming material used is metal nickel, and the ...

Embodiment 2

[0024] Embodiment two comprises the steps identical with embodiment one, and its main difference is:

[0025](1) Substrate preparation

[0026] (2) Metal micro-electroforming: the micro-casting material used is SU-8 negative photoresist, and its thickness is 500 microns. When forming the photoresist mold, the exposure time was 320 seconds and the developing time was 10 minutes. When removing the photoresist mold, immerse the entire glass piece in acetone for 48 hours. After the photoresist is removed, rinse it with deionized water and dry it.

[0027] (3) Screen printing carbon nanotube slurry: in the slurry composition ratio, the mass ratio of the organic solvent and the carbon nanotube is 16:1, wherein the organic solvent is composed of terpineol and ethyl alcohol with a mass ratio of 100:5 Cellulose composition. The mesh number of the screen plate is 400, and the thickness of the carbon nanotube slurry silk screen layer is 10 microns.

[0028] (4) Microstructure curing ...

Embodiment 3

[0031] Embodiment three comprises the steps identical with embodiment one, and its main difference is:

[0032] (1) Substrate preparation

[0033] (2) Metal micro-electroforming

[0034] (3) Screen printing carbon nanotube slurry: in the slurry composition ratio, the mass ratio of the organic solvent and the carbon nanotube is 12:1, wherein the organic solvent is composed of terpineol and ethyl alcohol with a mass ratio of 100:2 Cellulose composition. The mesh number of the screen plate is 300, and the thickness of the carbon nanotube slurry silk screen layer is 12 microns.

[0035] (4) Microstructure curing molding: the heat treatment temperature is 300 degrees, and the holding time is 1 hour.

[0036] The final three-dimensional carbon nanotube configuration is a comb-like electrode structure with a curved configuration. The radius of curvature of each electrode is 1 mm, and the length of the electrode is 200 microns. The carbon nanotubes are located at the lead of each m...

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PUM

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Abstract

A method for preparing a three-dimensional microstructure of one-dimensional nanomaterials in the field of nanotechnology, comprising: substrate preparation: pretreating the substrate used to prepare the microstructure; metal micro-electroforming: on the treated substrate Forming a photoresist micro-mold with a metal electrode structure with the required structure and arrangement characteristics, and electroplating metal materials in the micro-mold to form a metal micro-configuration; screen printing one-dimensional nanomaterial slurry: including preparing one-dimensional nanomaterial slurry Material, and the one-dimensional nanomaterial slurry is coated on the side wall and surface of the formed metal micro-configuration structure by screen printing method; the microstructure is solidified and formed: the formed one-dimensional nanomaterial is removed by heating and heat preservation treatment Organics in Microconfiguration, Stabilizing 1D Nanomaterial Structures. The invention has excellent compatibility with microelectronic manufacturing technology, can obtain better processing precision, and has simple technology, and is very suitable for mass production.

Description

technical field [0001] The invention relates to a preparation method in the field of nanotechnology, in particular to a preparation method of a three-dimensional microstructure of a one-dimensional nanomaterial. Background technique [0002] The application of one-dimensional nanomaterials in micro-nano electronic devices is mainly realized by using micro-nano electronic processing technology through various micro-pattern structures. The commonly used processing method is generally to combine the film forming process and the patterning process. At present, in the patterning technology of one-dimensional nanomaterials, the patterning technology of carbon nanotubes has been studied more. The three-dimensional structural ability of the nanotube microstructure is very low, which cannot meet the special requirements of the three-dimensional configuration of one-dimensional nanomaterials with a certain height in the structure of special micro-nano electronic devices, which hinder...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/00G03F7/12G03F5/00
Inventor 侯中宇张亚非蔡炳初徐东魏星
Owner SHANGHAI JIAOTONG UNIV
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