Manufacturing method for electronic device

A technology for electronic devices and manufacturing methods, applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve problems such as disconnection reliability, and achieve the effect of eliminating equipment investment and reducing costs

Inactive Publication Date: 2009-07-29
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Therefore, when a force such as external stress or bending is applied, there is a problem of connection reliability such as easy disconnection at the connection portion between the above-mentioned connection terminal portion and the substrate wiring.

Method used

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  • Manufacturing method for electronic device
  • Manufacturing method for electronic device
  • Manufacturing method for electronic device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0065] (electronic device)

[0066] Next, the present invention will be described in detail.

[0067] figure 1 It is a figure which shows and explains the electronic device manufactured using the manufacturing method of the electronic device of this invention, and is figure 2 The side sectional view of A—A line looking down. figure 1 Among them, symbol 1 is the electronic device of the present invention. figure 2 It is a plan view showing a part of the electronic device 1 (resin 35 described later) seen through from a vertical direction, and is a diagram for explaining the electronic device 1 of the present invention.

[0068] Such as figure 1 As shown, the electronic device 1 includes, for example, a substrate 5 made of Si and a pedestal 10 formed on the substrate. The above-mentioned pedestal 10 is, for example, a plate-shaped substrate made of materials such as Si and ceramics. In addition, the above-mentioned pedestal 10 may be an organic substrate, an electronic c...

no. 2 approach

[0105] An example of a preferred embodiment of the electronic device of the present invention will be described below.

[0106] The first embodiment described above is different in that after the seed layer 13 is formed on the entire surface of the substrate 5 and the pedestal 10, plating is performed on the region (opening 15b) partitioned by the photoresist 15. processing, the second wiring 25 is formed. In contrast, in this embodiment, a silane coupling process is performed on a substrate to form a silane coupling film, a seed layer is formed on the silane coupling film, and a plating process is performed to form a second wiring. In addition, the basic configuration of other pattern forming methods is the same as that of the above-mentioned first embodiment, and the same symbols are assigned to common components, and detailed description thereof will be omitted.

[0107] Figure 5 (a)~(d) means along figure 2 The cross-sectional view taken along the line BB of the elect...

no. 3 approach

[0121] Next, a third embodiment of the electronic device of the present invention will be described.

[0122] Image 6 with Figure 7 It is a figure explaining the electronic device in 3rd Embodiment. Image 6 yes means Figure 7 The side sectional view of the C—C line looking down. Image 6 Symbol 2 in is an electronic device. Figure 7 It is a plan view that sees through a part of the electronic device 1 (resin 35 described later) from the vertical direction, and is a diagram for explaining the electronic device 2 of the present invention. In addition, the same code|symbol is attached|subjected to the component common to the said 1st Embodiment, and detailed description is abbreviate|omitted.

[0123] In the electronic device 2 of the present embodiment, the second wiring 25 of the electronic device 1 of the above-described embodiment covers and is connected to the electrode 34 . Here, the electrode 34 is formed on the electrode surface 32 of the IC chip 30, and is for...

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PUM

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Abstract

The present invention provides a manufacturing method of an electronic device, which includes the steps of preparing a pedestal with an inclined surface, forming a first wiring on a substrate, and attaching the pedestal with the inclined surface to the substrate through an adhesive layer. In the process on the substrate, the second wiring is simultaneously performed through the upper surface of the inclined surface of the pedestal and the second wiring extending from the upper surface of the pedestal and connected to the first wiring. The process of forming and connecting the first wiring and the second wiring.

Description

technical field [0001] The invention relates to a method for manufacturing an electronic device. Background technique [0002] In recent years, research and development of micro / ultra-high performance electronic components (MEMS) using MEMS (Micro Electro Mechanical System) technology has become popular. Many electronic components using MEMS technology are known, and as one of them, for example, an inkjet head constituting an inkjet printer is known. However, in electronic components (electronic devices) manufactured using MEMS technology and electronic components not manufactured using MEMS technology, due to the limitation of the area of ​​the substrate constituting the electronic component or other reasons, sometimes the wiring formed on the substrate and the wiring mounted on the substrate The terminals of mounted components such as semiconductor chips cannot be directly connected to the substrate surface. [0003] For example, when a semiconductor chip is mounted on a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L21/60
CPCH01L2924/14H01L2224/82007H01L2224/24998H01L2224/76155H01L24/25H01L2224/05554H01L2224/25H01L2924/00012
Inventor 桥元伸晃
Owner SEIKO EPSON CORP
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