Electronic component identification process and apparatus
A technology of electronic devices and identification methods, which is applied in the direction of electrical components, electrical components, character and pattern recognition, etc. It can solve the problems of coating and black treatment parts falling off, unavoidable reflected light, etc., and achieve the effect of reducing recognition errors
Inactive Publication Date: 2009-08-12
JUKI CORP
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Problems solved by technology
[0008] However, the thickness of the DLC film coating is about 1 μm. During the process of repeatedly absorbing, holding, and assembling the chip device up to hundreds of thousands of times, the wear and tear between the chip device and the chip device will cause the coating and the black treatment part to fade. fall off
Moreover, the reflected light from the lower surface of the suction nozzle cannot be avoided only by controlling the amount of light of the illumination, so there is a problem that accurate image recognition cannot be performed because the part exposed from the chip device adsorbed on the suction nozzle is captured.
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[0021] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. figure 1 It is a perspective view of an electronic component mounting machine equipped with an identification device as an embodiment of the present invention. figure 2 Is the lighting unit of the electronic device identification device, image 3 is a block diagram showing the system structure, Figure 4 It is a flowchart showing the operation of the electronic device recognition device using image processing, Figure 5 It is an image diagram showing a chip device and a portion exposed from the chip device of a suction nozzle holding the chip device.
[0022] First, refer to figure 1 , the overall structure of the electronic component mounting machine 10 will be described. figure 1 Among them, 13 is a substrate conveying path. The substrate 19 conveyed by the substrate conveyance path 13 is held near the center portion of the substrate conveyance path 13 . The ...
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Abstract
The present invention provides a method and device for identifying an electronic device. The purpose of the electronic device mounting device for mounting an electronic device on an electronic circuit is to enable the electronic device to be photographed even when the suction position of the suction nozzle deviates from the center of the chip device. Correctly identify the chip device. The electronic device assembling device (10) of the present invention is provided with lower lighting (25) and side lighting (27) on the basis of coaxial lighting (23), while changing the lighting angle to irradiate light, it can be judged by image recognition processing whether The underside of the suction nozzle is photographed, and the image taken after reducing the exposed portion of the chip device attached to the suction nozzle to the extent that does not affect the image recognition processing is read, and image recognition data is generated through the image recognition processing.
Description
technical field [0001] The invention relates to an electronic device recognition method and device for image recognition of the position of the electronic device based on the image obtained by shooting the electronic device sucked and held on the suction nozzle from below. Background technique [0002] In the field of electronic device manufacturing, as a method of positioning electronic devices and substrates with high precision, a method of applying image recognition is widely used. This method detects the positions of the substrate mark of the substrate and the electrodes, edges, or centers of gravity of the electronic device by recognizing images obtained by photographing the substrate and the electronic device. [0003] In the position detection of the electronic device by image recognition, the electronic device is sucked and held on the suction nozzle, moved above the imaging device, and photographed with a CCD camera. However, in recent years, higher density and hig...
Claims
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IPC IPC(8): H05K13/08H05K13/00G01N21/85G06K9/64H05K13/04
Inventor 栗田直树
Owner JUKI CORP