Semiconductor substrate surface chemical processing method and apparatus

Abstract

The invention belongs to the field of semiconductor manufacturing industry. Specifically disclosed is a new chemical treatment method and device for the surface of a semiconductor substrate. In the chemical treatment method of the present invention, the semiconductor substrate is placed on the top of the chemical solution by using a bracket, and there is a certain distance between the lower surface of the semiconductor substrate and the liquid surface of the chemical solution, and the chemical solution is sprayed onto the lower surface of the semiconductor substrate by a spraying device. , so as to chemically treat the lower surface; wherein, the height of the chemical solution sprayed by the injection device is the distance between the lower surface of the semiconductor substrate and the upper port of the injection device. The device of the present invention includes a chemical tank containing a chemical solution, a support for placing a semiconductor substrate above the chemical solution, and a spraying device for spraying the chemical solution onto the lower surface of the semiconductor substrate. The chemical treatment method and its device of the present invention can only perform chemical treatment on a certain surface of the semiconductor substrate without any protection on the other surface.

Description

technical field [0001] The present invention relates to a technology for chemically treating a semiconductor substrate in the semiconductor manufacturing industry, in particular to a method for performing wet chemical treatment on a semiconductor substrate in the field of preparing semiconductor solar cells; more specifically, it involves performing wet chemical treatment on a certain surface of a semiconductor substrate The method of processing. Background technique [0002] Treating the surface of a semiconductor substrate with a chemical solution is a common process in the semiconductor manufacturing industry. For example, a surface etching process and a cleaning process are performed on the semiconductor substrate. Generally, the above wet chemical treatment process is carried out by immersing the semiconductor substrate in a chemical solution. In this case, wet chemical treatment is performed on both surfaces of the semiconductor substrate. [0003] However, in the i...

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Problems solved by technology

However, the above-mentioned method of protecting with a mask and then performing wet chemical treatment also has great disadvantages: it not only increases the steps of coating and cleaning the film in the operation process, but also increases the cost of raw materials and the amount of wastewater generated during the treatment process.

In the above two cases, chemical treatment will be performed on the upper surface of the semiconductor substrate that does not need to be processed, so that the quality of the semiconductor substrate is unqualified or the uniformity is very poor, which cannot meet the requirements

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