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High heat conductive LED encapsulation structure

A technology of light-emitting diodes and packaging structures, which is applied to semiconductor devices, electrical components, circuits, etc., and can solve problems such as reliability problems, excessively long gold wires 106 that are easy to break, etc.

Inactive Publication Date: 2009-10-21
EVERLIGHT ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As mentioned in the previous paragraph, when the volume of the metal block 104 is too large, the difference in thermal expansion coefficient between the resin 112 and the metal block 104 or the pin 114 may cause the overly long gold wire 106 to be easily broken and cause reliability problems. The problem

Method used

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  • High heat conductive LED encapsulation structure
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Embodiment Construction

[0020] As mentioned above, the present invention provides such as figure 1 The improved structure of the high thermal conductivity light-emitting diode packaging structure shown, one of the electrodes of the light-emitting diode is connected to the carrying metal block with a gold wire to shorten the length of the gold wire, and a high thermal conductivity insulating coating is added to the metal block and the carrying metal block between substrates. The encapsulation structure of the highly thermally conductive light emitting diode will be described in detail below in conjunction with embodiments.

[0021] Such as figure 2 As shown, is a cross-sectional view of a packaging structure of a highly thermally conductive light-emitting diode according to an embodiment of the present invention. The high-power LED 202 is fixed on a large metal block 204 , and the heat generated by the LED 202 is conducted to a connected substrate 216 through the metal block 204 by utilizing the hi...

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Abstract

A packaging structure of a light-emitting diode with high thermal conductivity has a metal block. A high thermal conductivity insulating coating is located between the metal block and its substrate. A light emitting diode chip is fixed on the metal block. The LED chip has two or more electrodes, the two electrodes are separated from the metal block, and one of the electrodes is connected with the metal block by a gold wire. Two or more pins are located around the metal block, the pins are separated from the metal block, and one or more pins are connected to the metal block with gold wires. A resin material encapsulates and fixes the above components on the metal block.

Description

technical field [0001] The invention relates to a packaging structure, in particular to a packaging structure of a light emitting diode. Background technique [0002] As the operating power of the LED assembly increases, the heat dissipation design of the LED packaging structure becomes more and more important. In order to make the heat generated by the light-emitting diodes to be discharged from the light-emitting chip smoothly, a metal block is usually installed under the chip to absorb the heat generated by the light-emitting chip. In order to improve the heat dissipation efficiency, a larger metal block is usually installed, which increases the volume of the package, and also makes the gold wire connecting the light-emitting chip and the external electric energy relatively longer. The above-mentioned packaging structure tends to be easily broken due to the large difference in thermal expansion coefficient between packaging materials under severe temperature changes, res...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
Inventor 吴易座
Owner EVERLIGHT ELECTRONICS