Visual inspection apparatus, visual inspection method, and peripheral edge inspection unit that can be mounted on visual inspection apparatus
A visual inspection device and visual inspection technology, which is applied in the direction of semiconductor/solid-state device testing/measurement, etc., can solve the problems of longer production cycle time and the need to hand over workpieces, etc.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
no. 1 Embodiment approach
[0081] Such as figure 1 As shown, the visual inspection device 1 is at the front facing the inspector ( figure 1 In the lower part) there is an inspection part 2, and a loader part 3 is connected to the back side of the inspection part 2. To the loader unit 3 , wafer trays 4A, 4B are connected in parallel, and the wafer trays 4A, 4B accommodate semiconductor wafers W (hereinafter referred to as wafers W) as workpieces. Wafer trays 4A and 4B can accommodate a plurality of wafers W at predetermined pitches in the vertical direction. For example, uninspected wafers W are accommodated on wafer tray 4A, and inspected wafers W are accommodated on wafer tray 4B. Furthermore, each wafer tray 4A, 4B can be attached to and detached from the loader unit 3 independently.
[0082] The loader unit 3 has a transport robot arm 5 . The transfer robot arm 5 is composed of a multi-joint arm, and a handle 5A at the front end thereof is provided with a suction hole 6 for sucking and holding the...
no. 2 Embodiment approach
[0118] The second embodiment is characterized in that the edge inspection unit is provided on the macro inspection unit for visual inspection. Other structures and functions are the same as those of the first embodiment.
[0119] like Figure 4 As shown, in the appearance inspection device 51 , an edge inspection unit 61 (outer edge inspection unit) is detachably provided on the mounting plate 15 of the macro inspection unit 10 . The edge inspection unit 61 has a fixing unit 62 fixed to the mounting plate 15 , a pedestal 63 , and a base unit 42 on which the enlarged image acquisition unit 44 is attached, and the base unit 42 is mounted so as to be freely accessible to and separated from the position P2. like Figure 5 As shown, at the inspection position closest to the base portion 42 , the edge portion of the wafer W held horizontally on the macro inspection unit 22 enters the concave portion 43 . In addition, as indicated by phantom lines, the position at which the base p...
no. 3 Embodiment approach
[0125] The third embodiment is characterized in that an edge portion inspection unit is provided on an automatic macro inspection unit that automatically extracts defects from images captured by an imaging device by image processing. Other structures and functions are the same as those of the first embodiment.
[0126] like Figure 6 and Figure 7 As shown, the appearance inspection device 71 has a vibration-damped mounting plate 72 on which an automatic macro inspection unit 73 is constructed. The automatic macro inspection unit 73 has an inspection table 74 , an illumination unit 75 and an imaging unit 76 fixed so as to sandwich the inspection table 74 in the X direction. The inspection table 74 is composed of an X-axis table 77 , a Z-axis table 78 , and a rotation shaft 79 as a rotation mechanism, and a holding plate 80 for absorbing and holding a wafer is fixed to the rotation shaft 79 . The illuminating unit 75 has a line light source that irradiates the upper surface ...
PUM
Login to View More Abstract
Description
Claims
Application Information
Login to View More