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Heat radiating device

A heat dissipation device and heat sink technology, applied in cooling/ventilation/heating transformation, instrument cooling, instrument, etc., can solve the problems of cumbersome assembly of fans and heat sinks, and achieve the effect of simple and convenient assembly

Inactive Publication Date: 2010-01-20
FU ZHUN PRECISION IND SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this heat dissipation device, the fixing frame needs to be fixed to the radiator with more screws, and the assembly between the fan and the radiator is relatively cumbersome.

Method used

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  • Heat radiating device
  • Heat radiating device
  • Heat radiating device

Examples

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Embodiment Construction

[0011] see figure 1 , the heat dissipation device includes a heat sink 10 , a fan 30 and a fixing frame 20 for fixing the fan 30 to the heat sink 10 .

[0012] The radiator 10 is integrally made of metal material, and includes a bottom 12 and a plurality of cooling fins 14 extending from the bottom 12 . The bottom surface of the bottom 12 is in contact with electronic components (not shown) to absorb heat. The outermost cooling fin 14 of the heat sink 10 includes a support section 140 extending from the bottom 12 and a curved section 142 extending upward from a top edge of the support section 140. The thickness of the support section 140 gradually changes during its upward extension. Small, the curved section 142 has an ear-shaped cross section, and an inclined surface 144 is provided on the outside of the curved section 142 to facilitate cooperation with the fixing frame 20 . The outer surfaces of the two outermost heat dissipation fins 14 of the heat sink 10 respectively d...

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PUM

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Abstract

A radiation device includes a radiator, a fan and a fixing frame fixing the fan to the radiator, which includes a bottom and several radiation fins extending from the bottom, and two locating grooves are set on the outside fins relative to the radiator, said fixing frame includes a fixed panel bearing said fan and a principal part connected with the panel and located in the locating grooves and protruding strips blocked in the grooves of the radiator are set on the principal part.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for electronic components. Background technique [0002] As we all know, electronic components such as central processing units generate a lot of heat during operation. In order to prevent the temperature of the electronic component from rising due to the accumulation of heat and thus cause its operation to be unstable, the electronic component usually needs to be equipped with a heat dissipation device to assist in heat dissipation. [0003] The traditional heat dissipation device includes a heat sink, which has a bottom plate for contacting electronic components to absorb heat and a plurality of cooling fins arranged on the bottom plate. In order to improve the heat dissipation capability of the heat sink, the heat dissipation device also includes a fan for providing strong convection airflow to the heat sink. The fan is fixed on the radiator through a fi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20G12B15/04G06F1/20H01L23/467
Inventor 帅春江鲁翠军钟勇
Owner FU ZHUN PRECISION IND SHENZHEN