Method for manufacturing optical semiconductor module

Abstract

In an optical semiconductor module, a transparent resin spacer is interposed between an optical guide and a semiconductor device. As a result, the optical semiconductor module is formed of the minimum required members so as to suppress the influence given by the reflected light. Also, the optical semiconductor module can be manufactured without employing the manufacturing step of a high cost.

Description

[0001] This application is based on the divisional application of No. 200410104898.3 patent application for invention filed on December 24, 2004, entitled "Optical Semiconductor Module and Method for Manufacturing the Module". [0002] Refer to related application [0003] This application is based on and claims priority from prior Japanese Patent Application No. 2003-432231 filed on December 26, 2004, and prior Japanese Patent Application No. 2003-432232 filed on December 26, 2004, both of which were filed in The entire contents of the prior application are hereby incorporated by reference. technical field [0004] The present invention relates to an optical semiconductor module and a method of manufacturing the module, and more particularly, to an optical semiconductor having a relatively simple structure suitable for short-distance optical transmission and capable of achieving stable optical coupling therebetween. Background technique [0005] In large scale integrated c...

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Problems solved by technology

Thus, the yield was not improved

In addition, limited cost reduction

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