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Defects detection device and method

A defect inspection and defect technology, which is applied in the direction of optical test defect/defect, semiconductor/solid-state device test/measurement, etc., can solve the problem that the defect image cannot be directly confirmed, and achieve the effect of suppressing vibration

Inactive Publication Date: 2007-07-18
SONY CORP
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  • Claims
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Problems solved by technology

In addition, if the edge part vibrates, the focus of the imaging device will also vibrate, for example, there is a problem that the operator cannot directly confirm the defective image.

Method used

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  • Defects detection device and method
  • Defects detection device and method

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Embodiment Construction

[0032] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0033] FIG. 1 is a schematic plan view showing a defect inspection device according to an embodiment of the present invention.

[0034] The defect inspection apparatus 10 includes: a cassette 2 for accommodating a semiconductor wafer substrate 1 (hereinafter simply referred to as a wafer); a pre-positioner 3; an XY moving mechanism 5; a transfer robot 4; and an imaging device 11 (see FIG. 2 ). The transfer robot 4 transfers the wafer 1 between the cassette 2 , the pre-positioner 3 and the XY moving mechanism 5 . The pre-positioner 3 roughly adjusts (pre-positions) the in-plane rotation angle of the wafer 1 transferred from the transfer robot 4 .

[0035] The defect inspection apparatus 10 handles wafers 1 of, for example, 8 inches and 12 inches, but wafers 1 of sizes other than the above-mentioned sizes can also be handled. The box 2 may be either an open type or a cl...

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Abstract

The invention provides a defect detecting device and a defect detecting method for reliably detecting a defect on an edge part of a semiconductor chip substrate. A XY travel mechanism (5) comprises: a supporting part (12) for supporting the chip (1); a X axis travel mechanism (14) for moving the supporting part (12) upwards along the direction of the X axis; and a Y axis travel mechanism (15) for moving the supporting part (12) and the X axis travel mechanism (14) upwards along the direction of the Y axis perpendicular to the X axis. The supporting part (12) has a disk shape supporting table (13) for supporting a whole back face (1b) of the chip (1) to hold the chip (1) by, e.g., vac sorb. Due to at least the edge part (1c) of the back face (1b) of the chip (1) is supported by the supporting part (13), oscillating of the edge part (1c) can be prevented, thus defect of the edge part (1c) can be reliably detected.

Description

technical field [0001] The present invention relates to a technique for inspecting defects of substrates such as semiconductors, and more particularly to a defect inspection device and a defect inspection method for inspecting defects at edge portions of substrates. Background technique [0002] At present, as a device for inspecting defects generated at the edge of a substrate such as a semiconductor wafer, there is a device including: a rotary table that absorbs and holds the center of the wafer; An imaging device that captures an image of a part (for example, refer to Patent Document 1). The reason why the central portion of the substrate is supported in this way is to inspect for defects on both the front and back surfaces of the edge portion of the substrate. [0003] Patent Document 1: Japanese Patent Application Publication No. WO 03 / 028089 (FIG. 6) [0004] However, when it is desired to inspect defects existing in the edge portion in detail with a high-resolution ...

Claims

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Application Information

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IPC IPC(8): G01N21/95H01L21/66
Inventor 奥山真继近藤浩史
Owner SONY CORP
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