Defects detection device and method

A defect inspection and defect technology, which is applied in the direction of optical test defect/defect, semiconductor/solid-state device test/measurement, etc., can solve the problem that the defect image cannot be directly confirmed, and achieve the effect of suppressing vibration

Inactive Publication Date: 2007-07-18
SONY CORP
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Problems solved by technology

In addition, if the edge part vibrates, the focus of the imaging device will also vibrate, f

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  • Defects detection device and method
  • Defects detection device and method
  • Defects detection device and method

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[0032] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0033] Fig. 1 is a schematic plan view showing a defect inspection apparatus according to an embodiment of the present invention.

[0034] The defect inspection apparatus 10 includes: a cassette 2 that houses a semiconductor wafer substrate 1 (hereinafter simply referred to as a wafer); a pre-positioner 3; an XY moving mechanism 5; a transport robot 4; and an imaging device 11 (refer to FIG. 2). The transfer robot 4 transfers the wafer 1 between the cassette 2, the pre-positioner 3 and the XY moving mechanism 5. The pre-positioner 3 performs rough adjustment (pre-positioning) of the rotation angle in the plane of the wafer 1 with respect to the wafer 1 transported from the transport robot 4.

[0035] The defect inspection apparatus 10 processes wafers 1 of 8 inches and 12 inches, for example, but can also process wafers 1 of sizes other than the above-mentioned sizes. The b...

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Abstract

The invention provides a defect detecting device and a defect detecting method for reliably detecting a defect on an edge part of a semiconductor chip substrate. A XY travel mechanism (5) comprises: a supporting part (12) for supporting the chip (1); a X axis travel mechanism (14) for moving the supporting part (12) upwards along the direction of the X axis; and a Y axis travel mechanism (15) for moving the supporting part (12) and the X axis travel mechanism (14) upwards along the direction of the Y axis perpendicular to the X axis. The supporting part (12) has a disk shape supporting table (13) for supporting a whole back face (1b) of the chip (1) to hold the chip (1) by, e.g., vac sorb. Due to at least the edge part (1c) of the back face (1b) of the chip (1) is supported by the supporting part (13), oscillating of the edge part (1c) can be prevented, thus defect of the edge part (1c) can be reliably detected.

Description

technical field [0001] The present invention relates to a technique for inspecting defects of substrates such as semiconductors, and more particularly to a defect inspection device and a defect inspection method for inspecting defects at edge portions of substrates. Background technique [0002] At present, as a device for inspecting defects generated at the edge of a substrate such as a semiconductor wafer, there is a device including: a rotary table that absorbs and holds the center of the wafer; An imaging device that captures an image of a part (for example, refer to Patent Document 1). The reason why the central portion of the substrate is supported in this way is to inspect for defects on both the front and back surfaces of the edge portion of the substrate. [0003] Patent Document 1: Japanese Patent Application Publication No. WO 03 / 028089 (FIG. 6) [0004] However, when it is desired to inspect defects existing in the edge portion in detail with a high-resolution ...

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Application Information

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IPC IPC(8): G01N21/95H01L21/66
Inventor 奥山真继近藤浩史
Owner SONY CORP
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