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Semiconductor memory device having reduced voltage coupling between bit lines

A storage device and semiconductor technology, applied in information storage, static memory, digital memory information and other directions, can solve the problems of read operation failure, read error, and read operation reliability reduction of sense amplifiers, and achieve reliable, small effect of bit line voltage coupling

Inactive Publication Date: 2007-08-01
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the potential difference formed between the selected bit line BL and the selected bit line BLb may be smaller than the sensing margin, causing the read operation of the sense amplifier to fail.
[0023] As a result, it can be seen that even though there is a constant parasitic capacitance, the reliability of the read operation is reduced because the bit line voltage coupling occurs strongly or weakly depending on the actual value of the cell data stored in the adjacent memory cells
[0024] As mentioned above, bit line voltage coupling can cause cell data flipping in write operations and read errors in read operations

Method used

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  • Semiconductor memory device having reduced voltage coupling between bit lines
  • Semiconductor memory device having reduced voltage coupling between bit lines
  • Semiconductor memory device having reduced voltage coupling between bit lines

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Embodiment Construction

[0055] 5 is a circuit diagram of a representative portion of a cell core circuit of an SRAM according to an embodiment of the present invention. The conventional techniques described with reference to FIGS. 1 to 4 and 13 provide the basis for understanding and operating the present invention. The phenomenon of cell data flipping during write operations and readout errors during read operations due to capacitive voltage coupling between bit lines is described in detail.

[0056] Referring to FIG. 5 illustrating a representative portion of a cell core circuit of an SRAM according to an embodiment of the present invention, the precharge and equalization circuit 22 and the equalization driver 42 have a different configuration from the conventional SRAM of FIG. 1 .

[0057] In FIG. 5, each of the plurality of SRAM cells 1 constituting the memory cell array 10 may include six CMOS transistors P1, P2, N1, N2, N3, and N4, as shown in FIG. Each memory cell may be formed as a three-dim...

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Abstract

An enhanced semiconductor memory device capable of eliminating or minimizing a cell data flip phenomenon caused by capacitive voltage coupling between bit lines in different bit line pairs. Each memory cell is connected to a word line and between a pair of bit line. A first precharging and equalizing circuit us connected to a first bit line pair and a second precharging and equalizing circuit us connected to an adjacent second bit line pair. The first and second precharging and equalizing circuit are activated independently and at different times in order to reduce voltage coupling between neighboring bit lines in different bit line pairs, thereby minimizing or eliminating a cell data flip phenomenon of a neighboring memory cell caused by voltage coupling between bit lines.

Description

[0001] Cross References to Related Applications [0002] Under 35 U.S.C §119, this application claims the benefit of Korean Patent Application No. 10-2006-0008789 filed on January 27, 2006, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to a semiconductor memory device, and more particularly, to a volatile semiconductor memory device such as a static random access memory (SRAM) with reduced bit line (capacitive) voltage coupling. Background technique [0004] Contemporary high-performance consumer electronic equipment, such as portable multimedia players (PMP), personal computers, and electronic communication devices (e.g., cellular phones), include large volatile memory devices such as SRAM with high-speed operation and high integration semiconductor storage device. Low power consumption and reliability during high-speed operation are especially important in semiconductor memory devices utilized in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G11C11/413
CPCG11C11/413G11C7/12G11C7/1096G11C7/06
Inventor 韩公钦朴哲成金衡辰俞炳旭
Owner SAMSUNG ELECTRONICS CO LTD