Synthesis process of phosphoric phenolic resin

A phosphoric acid phenolic resin and a synthesis process technology, applied in the field of the synthesis process of phosphoric acid phenolic resin, can solve the problems of gap, unsatisfactory heat resistance and the like

Inactive Publication Date: 2007-08-22
李超
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The ordinary phenolic resin is brittle, although it has a certain heat resistance, but there is a big gap with practical use. With the continuous development of its use, the heat resistance can no longer meet the requirements of various industries; so the improvement of phenolic resin Sex has always been a research topic in the chemistry and application of phenolic resins.
[0003] Like other polymer materials, the heat resistance of phenolic resin is an important research topic. According to reports, researchers have used various materials and methods to modify it, but so far there is little research on the modification of it by introducing phosphoric acid. There are reports

Method used

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  • Synthesis process of phosphoric phenolic resin
  • Synthesis process of phosphoric phenolic resin

Examples

Experimental program
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example 1

[0012] Example 1: drop into 282g of phenol, 115g of 85% phosphoric acid in the there-necked flask equipped with cooling reflux, stirring and thermometer devices, add the catalyst and be warming up to 60°C of temperature, tap water cooling and reflux, react for 3 hours, and the reaction temperature is cooled to room temperature, 120g of paraformaldehyde was added, another catalyst was added, and the temperature was raised to 90°C for 1 hour of reaction. Then vacuumize to make the vacuum degree reach 300-650mmHg, so that the reactants can remove low molecular weight substances, hold for 0.5-1 hour, and discharge when the gel degree reaches 80-150s / 160±1°C, and phosphoric acid can be obtained Phenolic Resin.

example 2

[0013] Example 2: drop into phenol 282g, 85% phosphoric acid 115g in the there-necked flask equipped with cooling reflux, stirring and thermometer device, after adding catalyst, be warming up to temperature 60 ℃, tap water cooling reflux, react 3 hours, the reaction temperature is cooled to room temperature, 120g of paraformaldehyde was added, another catalyst was added, and the temperature was raised to 90°C for 5 hours of reaction. Then vacuumize to make the vacuum degree reach 300-650mmHg, so that the reactants can remove low molecular weight substances, hold for 0.5-1 hour, and discharge when the gel degree reaches 80-150s / 160±1°C, and phosphoric acid can be obtained Phenolic Resin.

example 3

[0014] Example 3: drop into 282g of phenol, 115g of 85% phosphoric acid in the there-necked flask equipped with cooling reflux, stirring and thermometer device, add the catalyst and be warming up to 60°C of temperature, tap water cooling and reflux, react for 3 hours, and the reaction temperature is cooled to room temperature, 120g of paraformaldehyde was added, another catalyst was added, and the temperature was raised to 140°C for 1 hour of reaction. Then vacuumize to make the vacuum degree reach 300-650mmHg, so that the reactants can remove low molecular weight substances, hold for 0.5-1 hour, and discharge when the gel degree reaches 80-150s / 160±1°C, and phosphoric acid can be obtained Phenolic Resin.

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Abstract

The present invention is synthesis process of phosphoric phenolic resin. The phosphoric phenolic resin is prepared with phosphoric acid, phenols, and water solution of formaldehyde or paraformaldehyde as materials, and through one technological process with regulated and controlled parameters. The phosphoric phenolic resin is one kind of high performance phenolic resin with high temperature resistance, strong acid and alkali corrosion resistance, flame resistance, etc.

Description

Technical field: [0001] The invention is a synthesis process of phosphoric acid phenolic resin. The process technology uses phenol, bisphenol A, resorcinol, hydroquinone, phosphoric acid, and formaldehyde solution or paraformaldehyde as raw materials, and controls the reaction temperature, time, catalyst and other process conditions in each reaction stage. Phosphoric acid phenolic resin corroded by strong acid and strong alkali, has a decomposition temperature above 420°C, and has excellent flame resistance, wear resistance and toughness. technical background: [0002] Phenolic resin is the earliest synthetic and industrialized synthetic resin with a history of more than 100 years. The ordinary phenolic resin is brittle, although it has a certain heat resistance, but there is a big gap with practical use. With the continuous development of its use, the heat resistance can no longer meet the requirements of various industries; so the improvement of phenolic resin Resilience...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/10C08G8/28
Inventor 李超
Owner 李超
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