Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Long film circuit board, and production method and production device therefor

A technology for circuit substrates and manufacturing methods, applied in the directions of printed circuit manufacturing, printed circuits, printed circuits, etc., can solve problems such as difficulty in implementation, difficulty in achieving riveting ease and heat resistance at the same time, and achieve reduced loss, reliable bonding, and easy handling. Effect

Inactive Publication Date: 2007-09-12
TORAY IND INC
View PDF4 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] However, in this method, in addition to the elongated film circuit board, a ladder-type connection member such as a thermoplastic film is required.
Furthermore, since it is a method using a thermoplastic film, it is difficult to implement when there is a heating process such as resin molding or soldering reflow in the subsequent process.
That is, it is difficult to achieve both the ease of caulking due to heat deformation and the heat resistance in the subsequent process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Long film circuit board, and production method and production device therefor
  • Long film circuit board, and production method and production device therefor
  • Long film circuit board, and production method and production device therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0258] As the base film constituting the flexible film substrate, a long polyimide film (“Capton” 150EN (trade name) manufactured by Toray Dupon Co., Ltd.) with a thickness of 25 μm was prepared. A 15-nm-thick chromium:nickel = 5.95 (weight ratio) alloy layer and a 150-nm-thick copper layer were sequentially laminated on the polyimide film by a roll-to-roll sputtering apparatus for processing long thin films.

[0259] On soda lime glass (thickness 1.1 mm, 300×350 mm) as a support plate, a peelable organic substance was coated with a die coater, and dried at 80° C. for 2 minutes. As the detachable organic matter, a UV-curable adhesive "SK Dyne" SW-22 (manufactured by Soken Chemical Co., Ltd.) and hardener L45 (manufactured by Soken Chemical Co., Ltd.) were used in a ratio of 100:3 (by weight). ) mixed substances. The thickness of the peelable organic layer after drying was 2 μm. Next, an air-blocking film (a polyester film provided with a silicone resin layer for easy parting...

Embodiment 2

[0276] A long thin film circuit board was produced in the same manner as in Example 1 except that the resin was applied over the entire width of the conveying space in the direction perpendicular to the conveying direction at a length of 0.4 mm in the conveying direction.

[0277] The connection strength was measured in the same manner as in Example 1, and it was 13N, which is sufficient strength for transportation in the subsequent process.

Embodiment 3

[0279] A long thin film circuit board was produced in the same manner as in Example 1 except that the temperature of the head of the heating and pressing mechanism 416 was set at 200°C.

[0280] When the connection strength was measured in the same manner as in Example 1, it was 4.7N, which has strength of the level used in the subsequent process. However, there is a concern that there may be a slight shortage when force is applied for intermittent feeding or the like.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

When a number of flexible circuit boards where a circuit pattern is formed on at least one surface are connected to each other so as to form a tape-style flexible circuit board, a space for conveyance is provided in the pairs of end portions facing each other of the flexible circuit boards, at least a portion of the space for conveyance protrudes in the direction parallel to the direction of conveyance of the flexible circuit boards, and the protruding space for conveyance overlaps and is fixed to a space for conveyance of an adjacent flexible circuit board.

Description

technical field [0001] The present invention relates to a long thin film circuit board using a flexible film, a manufacturing method, and a manufacturing apparatus thereof, which are suitable as a circuit board having a high-precision circuit pattern. Background technique [0002] With the weight reduction and miniaturization of electronic products, higher accuracy of layout of printed circuit boards is required. Since the flexible film substrate can be bent, three-dimensional wiring can be performed, and it is suitable for the miniaturization of electronic products, so the demand is increasing. For example, relatively narrow long film circuit boards made of polyimide are processed by the COF (Chip on Flex) technology used for IC connection to liquid crystal display panels. Thereby, the highest fine pattern can be obtained as a resin substrate. However, the development of miniaturization is approaching the limit. [0003] In miniaturization, there are indicators expressed...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00B65H37/04
CPCH05K2203/016Y10T156/17H05K2203/0264H05K3/0097H05K2203/1545H05K1/0393H05K2201/10598B65H37/04
Inventor 谷村宁昭赤松孝义奥山太黑木信幸
Owner TORAY IND INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com