Thermoelectric module
A technology of thermoelectric modules and thermoelectric elements, applied in circuits, electrical components, electric solid devices, etc., can solve the problems of slow air transmission, time difference, and large time difference, and achieve the effects of easy installation, reduced condensation, and improved reliability
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Embodiment approach 1
[0069] In the thermoelectric module according to Embodiment 1 of the present invention, the N-type thermoelectric element 13 and the P-type thermoelectric element 23 are arranged between the first support substrate 13 and the second support substrate 23 that are arranged to face each other. A plurality of N-type thermoelectric elements 11 and a plurality of P-type thermoelectric elements 21 are arranged in a predetermined arrangement so as to be adjacently grounded. And, as shown in FIG. 2A etc., the adjacent P-type thermoelectric elements 21 and N-type thermoelectric elements 11 are connected by means of the first connection electrodes 12 formed on the inner surface of the first support substrate 13, and by forming The adjacent N-type thermoelectric elements 11 and P-type thermoelectric elements 21 are connected to the second adjacent electrodes 22 on the inner surface of the second support substrate 23 . In this way, in the thermoelectric module according to Embodiment 1, be...
Embodiment approach 2
[0126] However, in the thermoelectric module according to the second embodiment of the present invention, as shown in FIG. 6A , the durability is improved by sealing the periphery of the support substrate with the sealing material 28 without mounting the temperature detection element. . That is, in the thermoelectric module shown in FIG. 6A , by sealing the periphery of the support substrate with the sealing material 28 , dew condensation of the thermoelectric module circuit is suppressed, and current leakage of the thermoelectric module can be reduced. In the present invention, the portion where the sealing material 28 is provided is not limited to the peripheral portion of the supporting substrate, but may be formed on the outer periphery of the substrate to seal a part of the thermoelectric element as will be described in detail later.
[0127] As the sealing material 28 , it is preferable to use a low-hardness adhesive, and more preferably, for example, a silicone adhesive...
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