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Thermoelectric module

A technology of thermoelectric modules and thermoelectric elements, applied in circuits, electrical components, electric solid devices, etc., can solve the problems of slow air transmission, time difference, and large time difference, and achieve the effects of easy installation, reduced condensation, and improved reliability

Active Publication Date: 2007-10-03
KYOCERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, in conventional devices, the temperature of the object to be processed is measured by the temperature detection element, and there is a distance between the thermoelectric element and the object to be processed, so there is a time difference between the temperature from the heat absorbing and releasing part to the temperature detection element.
In addition, since air is used as the object to be processed in refrigerators, etc., the transmission of air is slow, and the time difference becomes large.

Method used

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Embodiment approach 1

[0069] In the thermoelectric module according to Embodiment 1 of the present invention, the N-type thermoelectric element 13 and the P-type thermoelectric element 23 are arranged between the first support substrate 13 and the second support substrate 23 that are arranged to face each other. A plurality of N-type thermoelectric elements 11 and a plurality of P-type thermoelectric elements 21 are arranged in a predetermined arrangement so as to be adjacently grounded. And, as shown in FIG. 2A etc., the adjacent P-type thermoelectric elements 21 and N-type thermoelectric elements 11 are connected by means of the first connection electrodes 12 formed on the inner surface of the first support substrate 13, and by forming The adjacent N-type thermoelectric elements 11 and P-type thermoelectric elements 21 are connected to the second adjacent electrodes 22 on the inner surface of the second support substrate 23 . In this way, in the thermoelectric module according to Embodiment 1, be...

Embodiment approach 2

[0126] However, in the thermoelectric module according to the second embodiment of the present invention, as shown in FIG. 6A , the durability is improved by sealing the periphery of the support substrate with the sealing material 28 without mounting the temperature detection element. . That is, in the thermoelectric module shown in FIG. 6A , by sealing the periphery of the support substrate with the sealing material 28 , dew condensation of the thermoelectric module circuit is suppressed, and current leakage of the thermoelectric module can be reduced. In the present invention, the portion where the sealing material 28 is provided is not limited to the peripheral portion of the supporting substrate, but may be formed on the outer periphery of the substrate to seal a part of the thermoelectric element as will be described in detail later.

[0127] As the sealing material 28 , it is preferable to use a low-hardness adhesive, and more preferably, for example, a silicone adhesive...

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Abstract

A thermoelectric module having an excellent durability is provide. The thermoelectric module comprises: a first support substrate having a first inner surface, a first outer surface and a plurality of first connecting electrodes formed on the first inner surface; a second support substrate having a second inner surface opposed to the first inner surface, a second outer surface and a plurality of second connecting electrodes formed on the second inner surface; a plurality of P-type thermoelectric elements and a plurality of N-type thermoelectric elements provided between the first inner surface and the second inner surface; a temperature-detecting element provided on the first inner surface.

Description

technical field [0001] The present invention relates to a thermoelectric module suitable for cooling heat-generating bodies such as air conditioners, refrigerators, and semiconductors. Background technique [0002] Conventionally, thermoelectric elements using the Peltier effect have been used as thermoelectric elements for cooling because they generate heat at one end while absorbing heat at the other end by flowing an electric current. In particular, as pyroelectric elements, they are expected to be used in temperature control of laser diodes, small and simple-structured and chlorofluorocarbon-free (chlorofluorocarbon-free: Flonress) cooling devices, refrigerators, thermostatic baths, photodetection elements, and semiconductor manufacturing. Electronic cooling components such as devices, temperature regulation of laser diodes. [0003] For example, it is used in electronic components such as laser diodes to adjust the temperature, and temperature detection elements such a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/28H01L35/32H01L23/38H01L23/34H01S5/024
CPCH01L35/32H01L2924/0002H10N10/17H01L2924/00
Inventor 口町和一
Owner KYOCERA CORP