Magnetic head with conductive underlayer
一种磁头、下层的技术,应用在带金属薄板芯的磁头、磁记录头、制造磁通敏感磁头等方向,能够解决益处不大、磨擦等问题
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[0027] Described below are the best embodiments currently contemplated for carrying out the invention. This description serves to illustrate the general principles of the invention and is not meant to limit the inventive concepts claimed herein. In addition, specific features described herein may be used in combination with other features described in each of the various possible combinations and permutations.
[0028] In the drawings, similar and equivalent elements are numbered the same throughout the different figures.
[0029] As described herein, the preferred embodiment of the present invention includes a magnetic recording head having a conductive thin film layer deposited directly on the wafer prior to the first magnetic shield insulator, referred to herein as the "conductive underlayer". In another embodiment, a thin insulating underlayer is formed between the conductive underlayer and the substrate.
[0030] A preferred wafer material for magnetic recording heads i...
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