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Heat sink for electronic component

A technology for heat dissipation components and bases, which is applied in electrical components, electric solid state devices, semiconductor/solid state device components, etc., and can solve problems such as labor and time consumption

Inactive Publication Date: 2008-01-02
FANUC LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, in the inspection of electrical and electronic equipment or the investigation of failures, in order to find subtle damages on the conductive connection areas of electronic components (that is, to identify the causes of failures caused by the so-called external force to the heat dissipation parts), it takes a lot of time. a lot of labor and time

Method used

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  • Heat sink for electronic component
  • Heat sink for electronic component
  • Heat sink for electronic component

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Embodiment Construction

[0022] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings, common reference numerals are assigned to the same or similar structural components.

[0023] Referring to the accompanying drawings, Fig. 1 is a perspective view of a heat dissipation component 10 according to an embodiment of the present invention, Fig. 2 is a cross-sectional view of a heat dissipation component 10, Fig. 3 is a perspective view of a heat dissipation component 10 partially deformed due to an external force, and Fig. 4 is a schematic A front view of an application example of the heat dissipation member 10 is shown.

[0024] As shown in FIG. 1 , the heat dissipation component 10 has a base 12 and a plurality of heat dissipation protrusions 14 erected on the base 12 . The heat dissipation protrusions 14 include a first protrusion 16 and a second protrusion 18 having different rigidities. Also, the second protrusion 18 having a l...

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PUM

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Abstract

A heat sink including a base and a plurality of upright heat-radiating projections provided on the base. The heat-radiating projections include a first projection having a first rigidity, and a second projection having at least a second rigidity partially lower than the first rigidity. The second projection is located along an outer periphery of an array or configuration of the plurality of heat-radiating projections on the base.

Description

technical field [0001] The invention relates to a heat dissipation component attached to an electronic component for heat dissipation. Background technique [0002] In electrical and electronic equipment, in order to prevent malfunction or damage caused by heat of heat-generating electronic components such as microprocessors, it is known that heat-dissipating components (i.e. heat sinks) are directly or indirectly mounted on electronic components. structure. Generally, the heat dissipation part is composed of a plurality of fin-shaped or pin-shaped protrusions erected on the plate-shaped base to increase the overall surface area of ​​the metal block. Using the air flowing between these protrusions, the electronic components The heat is dissipated to the surrounding through the heat dissipation member. It is also known to use electric fans to force air to flow between the protrusions in order to increase the cooling capacity. [0003] For example, Japanese Unexamined Paten...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/367
CPCH01L2924/0002H01L23/467H01L23/3672H01L2924/00
Inventor 青山一成中村稔三浦真广
Owner FANUC LTD