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Apparatus and method for inspecting a pattern and method for manufacturing a semiconductor device

An inspection method and inspection device technology, which are used in semiconductor/solid-state device manufacturing, photoengraving process of pattern surface, semiconductor/solid-state device testing/measurement, etc. Insufficient capacity and other problems, to achieve the effect of high-resolution inspection

Inactive Publication Date: 2008-01-23
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In this way, when the size of the inspection object such as the line width of the layout is below the wavelength of the inspection light, the optical resolution is not enough, so it is not possible to obtain a sufficient output of the defect signal.
For this reason, in the prior art shown in Patent Document 1 (JP-A-7-128250), there is a problem of insufficient inspection capability.
Considering the fact that the wavelength of the inspection light is smaller than the size of the inspection object, fundamental changes in the optical conditions are required, making the design of the optical system very difficult.

Method used

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  • Apparatus and method for inspecting a pattern and method for manufacturing a semiconductor device
  • Apparatus and method for inspecting a pattern and method for manufacturing a semiconductor device
  • Apparatus and method for inspecting a pattern and method for manufacturing a semiconductor device

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Embodiment Construction

[0030] As a result of research by the present inventors, it has been found that high-resolution inspection can be performed even when the size of the inspection object is smaller than or equal to the wavelength of the inspection light by enhancing the light diffracted by the layout on the inspection object.

[0031] First, a first embodiment of the present invention will be described with reference to the drawings. In the present embodiment, a retardation plate is taken as an example as means for enhancing light diffracted by a pattern on an inspection object (diffraction light control means).

[0032] FIG. 1 is a configuration diagram for explaining an inspection device 1 according to a first embodiment of the present invention.

[0033] The inspection device 1 shown in FIG. 1 has: a first light projection system 2 for inspection by transmitted light, a second light projection system 3 for inspection by reflected light, and an image for the layout on the inspection object M. ...

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Abstract

An apparatus for inspecting a pattern, including: at least one of a first floodlight system for inspection by transmissive light and a second floodlight system for inspection by reflective light; an inspection optical system for capturing an image of the pattern on an object under inspection; and a stage for mounting and moving the object under inspection. The one of the first floodlight system and the second floodlight system includes a diffracted light control means for enhancing light diffracted by the pattern.

Description

technical field [0001] The present invention relates to a semiconductor device, a layout inspection device for manufacturing a liquid crystal display device, etc., a method for inspecting a layout, and a method for manufacturing a semiconductor device. Background technique [0002] In recent years, in the manufacture of semiconductor devices and the like, elements constituting circuits, wiring lines, and the like have been highly integrated and layouts have been miniaturized. Therefore, in the development process of such high integration and miniaturization, if there is a defect in the original mask of the layout transfer of the semiconductor device, etc., the correct layout projection cannot be performed on the substrate (wafer), etc., resulting in Defective. Therefore, it is necessary to perform defect inspection for inspecting mask defects. [0003] In such a mask defect inspection, a technique is disclosed in which a layout enlarged by an optical system is imaged on a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/88H01L21/66H01L21/00G01N21/956G03F1/84H01L21/027
CPCG01N21/95607G03F7/70625H01L22/12
Inventor 井上广渡边智英吉川绫司
Owner KK TOSHIBA