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SMD light-emitting diode packaging structure

A light-emitting diode, packaging structure technology

Inactive Publication Date: 2008-01-30
I-CHIUN PRECISION IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] However, the above-mentioned condensing cover 60a is a condensing element made by injection molding first, and finally fixed on the rubber seat 30a by adhesive technology, but the two process steps (that is, the process of injection molding and adhesion) are not Increase the process steps and time of SMD light-emitting diode packaging, resulting in high costs for manufacturers

Method used

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  • SMD light-emitting diode packaging structure
  • SMD light-emitting diode packaging structure
  • SMD light-emitting diode packaging structure

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Embodiment Construction

[0032] Please refer to Fig. 3 to Fig. 8, the present invention is a kind of SMD light-emitting diode packaging structure, which is made by the following steps:

[0033] 1. Feed material, providing thin metal material (not shown) in a continuous and uninterrupted manner, which can be conductive metals such as copper and iron.

[0034] 2. Using the first processing method, a plurality of support blocks (not shown) are continuously formed on the thin metal material, and each of these support blocks has a base 10 and several pins 20; the above-mentioned first processing method can be Stamped or etched.

[0035] 3. The rubber seat 30 is formed, and a thick rubber seat 30 is formed in the bracket blocks by the second processing method to fix the base 10 and the pins 20; the above-mentioned second processing method can For injection molding (Molding) or casting molding (Casting).

[0036] 4. In addition, before the step of the above-mentioned first processing method, or after the s...

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PUM

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Abstract

A packaging structure for an SMD light emitting diode comprises an adhesive seat, a base, a plurality of junction feet, at least one light emitting diode grain and a glue layer. The invention is characterized in that the adhesive seat is provided with a hollow functional area to fix the base and the junction feet, the base is positioned in the functional area and the junction feet are relatively arranged on the two sides of the base, the light emitting diode grain is arranged on the base and further more the light emitting diode grain and junction feet are connected by wires, and the glue layer, which is formed by solid polymer that can penetrate lights, fills the functional area on the adhesive seat and is higher than the height of the adhesive seat in order to form a reflection layer with light-concentrating function, and by using the glue layer instead of a wide-known light-concentrating cover, the invention can achieve the same effects with light-concentrating cover and save processing and manufacturing cost without too much extra time, cost and processing production.

Description

technical field [0001] The invention relates to a design of a light-emitting diode, in particular to a package structure of an SMD (surface mount) light-emitting diode. Background technique [0002] The general SMD (Surface Mount Device, surface mount) light-emitting diode packaging structure is mainly formed by injection molding a plastic seat on a base and several pins, and a light-emitting diode die is arranged on the base, which is made of a semiconductor The light-emitting elements made of materials are connected to the pins by wires on the light-emitting diode grains, and finally the light-emitting diode grains and wires are packaged in the plastic seat with epoxy resin, and then used as the circuit of the SMD light-emitting diode packaging structure After being turned on, the LED grain can be driven to make it emit light. [0003] However, in the existing SMD light emitting diode packaging structure currently on the market, in order to achieve luminous efficiency, se...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L23/28H01L23/488H01L25/00H01L25/075H01L33/54
CPCH01L2224/8592H01L2924/1815H01L2224/48091H01L2224/48247H01L2924/00014
Inventor 周万顺
Owner I-CHIUN PRECISION IND CO LTD