Circuit substrate and manufacturing method thereof

A technology of circuit substrate and manufacturing method, which is applied in the direction of printed circuit manufacturing, circuit, printed circuit, etc., can solve the problems such as the inability to form wiring, and achieve the effect of high adhesive strength and high insulation reliability

Inactive Publication Date: 2008-02-13
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cross-sectional shape of the wiring pattern obtained by this method is rectangular, and it is impossible to form a wiring pattern with a trapezoidal cross-section.

Method used

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  • Circuit substrate and manufacturing method thereof
  • Circuit substrate and manufacturing method thereof
  • Circuit substrate and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0200] Using a roll coater, a positive photoresist (manufactured by RomandHaus Co., Ltd., FR200-8cp) was coated with a thickness of 6 μm on an electrolytic copper foil with a width of 48 mm and a thickness of 35 μm (Mitsui Sinzoku) as a support. Mining Co., Ltd. product, VLP copper foil), after drying and curing at 100°C for 1 minute, a pattern with a pitch of 20 μm was drawn on the resist using an exposure developing device.

[0201] Use an exposure device with a wavelength of 365nm, a wavelength of 405nm, and a wavelength of 436nm as the main wavelength (manufactured by Yoshio Electric Co., Ltd., EP-70SAC-02, illuminance: 64mW / cm 2 ), at 630mJ / cm 2 The energy density was exposed, and then developed with 1.5% KOH solution for 65 seconds. The bottom opening is 6.9 μm, and the upper opening is 12.2 μm.

[0202]Then, using a gold plating solution (manufactured by EEJA, Tempelex #8400), at 65°C, DK=0.2A / dm 2 Electroplating was carried out for 1 minute under the condition of , ...

Embodiment 2

[0212] Using a roll coater, a positive photoresist (manufactured by RomandHaus Co., Ltd., trade name FR200-8CP) was coated with a thickness of 6.8 μm on an electrolytic copper foil with a width of 70 mm and a thickness of 35 μm as a support. (manufactured by Mitsui Metal Mining Co., Ltd., trade name: VLP copper foil), after drying and curing at 100° C. for 1 minute, a pattern at a pitch of 20 μm was drawn on this resist using an exposure device.

[0213] Use an exposure device with a wavelength of 365nm, a wavelength of 405nm, and a wavelength of 436nm as the main wavelength (manufactured by Yoshio Electric Co., Ltd., EP-70SAC-02, illuminance: 64mW / cm 2 ), with 630mJ / cm 2 The energy density was exposed, and then developed with 1.5% KOH solution for 65 seconds. The bottom opening is 6.2 μm, and the upper opening is 11.5 μm.

[0214] Then, using a gold plating solution (manufactured by EEJA, Tempelex #8400), at 65°C, DK=0.2A / dm 2 Gold plating was carried out for 1 minute unde...

Embodiment 3

[0224] On a PET film with a width of 48 mm and a thickness of 50 μm with an adhesive, a 3 μm thick electrolytic copper foil (Mitsui Metal Mining Co., Ltd., Microsin copper foil (extremely thin copper foil)) was laminated to prepare a two-layer laminated film. Using an etchant at 40° C. with a nozzle height of 15 cm, the two-layer laminated film was spray-etched for 20 seconds so that the thickness of the copper foil was 1 μm. The composition of the etching solution used here is adjusted within the range of hydrochloric acid 85.4-87.6 g / L, Cu ion concentration 115-135 g / L, and specific gravity 1.250-1.253. The etchant is sprayed with two nozzles, and the pressure adjusted to each nozzle is 2kg / cm 2 , The flow rate of each nozzle is 1.83 liters per minute.

[0225] Using a roll coater, a positive-type photoresist (manufactured by RomandHaus Co., Ltd., FR200-8CP) was applied to a thickness of 6.5 μm on the surface of the half-etched copper foil, and dried and cured at 100° C. fo...

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Abstract

A wiring board includes an insulating substrate and a wiring pattern. The wiring pattern includes a main body and an upper end portion and is embedded in the insulating substrate while exposing at least the upper end portion on a surface of the insulating substrate. The upper end portion has a cross-sectional width smaller than that of a lower end portion of the wiring pattern embedded in the insulating substrate. The upper end portion is formed of a metal that is more noble than a metal of the main body of the wiring pattern. The wiring board having this structure achieves very high adhesion of the wiring pattern to the insulating layer.

Description

technical field [0001] The present invention relates to a circuit board in which a wiring pattern having a trapezoidal cross section is embedded in an insulating substrate and has high adhesion to the wiring pattern, and a method for manufacturing such a circuit board having a wiring pattern having a trapezoidal cross section formed in an insulating substrate . Background technique [0002] Circuit boards are used to incorporate electronic components such as LSIs into electronic equipment. This circuit board is formed by etching using a three-layer film in which copper foil is laminated on an insulating film such as polyimide with an adhesive. However, as the line width of the formed wiring pattern becomes narrower, instead of The three-layer thin film uses two-layer CCL with a thinner metal layer, and forms a COF (Chip On Film) with ultra-fine patterns by the Subtractive method. In the COF of such ultra-fine patterns, etc., the width of the top of the conductor is narrowe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18H05K1/00
CPCH05K3/205H05K3/386H05K2201/2072H01L2924/0002H01L23/498H05K2203/0353H05K3/384H01L21/4846H05K2203/0307H05K2203/0384H05K2203/0156H05K2201/098H01L2924/00H01L23/12
Inventor 片岡龙男河村裕和
Owner MITSUI MINING & SMELTING CO LTD
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