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Fiber bundle and light-source equipment

A technology of optical fiber bundles and optical fibers, which is applied in the direction of bundled optical fibers, optics, and light guides, and can solve problems such as the limitation of the application range of optical fiber bundles, the degradation of optical fiber performance, and the collapse of the internal optical fiber core-cladding structure.

Inactive Publication Date: 2008-03-05
SUMITOMO ELECTRIC IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, since the temperature control in the longitudinal direction and the control of the glass diameter during stretching are complicated, this operation of fusion bonding leads to an increase in cost
Moreover, this results in low yields
Furthermore, there is a risk of the core-cladding structure of the inner fiber collapsing if the temperature is not adequately controlled
In such cases, the performance of the fiber will be degraded: for example, defects such as light leakage due to reduced numerical aperture, far-field pattern confusion, and generation of scattered light may be caused
[0005] As mentioned above, in the case where the end of the fiber bundle is fixed by an adhesive, the heat-resistant temperature of the end face depends on the adhesive used, so the range of application of the fiber bundle is limited
On the other hand, in the case where the optical fiber bundle is constructed such that the glass tube and the bundled optical fibers are integrated by melting without using an adhesive, the integrated operation is difficult, resulting in an increase in cost and easy degrade fiber performance

Method used

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  • Fiber bundle and light-source equipment
  • Fiber bundle and light-source equipment
  • Fiber bundle and light-source equipment

Examples

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no. 1 example

[0024] FIG. 1 is a schematic view showing a state in which a workpiece 55 as an irradiation target is irradiated with a light source device including an optical fiber bundle 10 according to a first embodiment of the present invention. The optical fiber bundle 10 constitutes a part of a light source device for manufacturing semiconductors: more specifically, the light source device collects output light from a plurality of laser diodes 52 and outputs high output light.

[0025] The optical fiber bundle 10 includes a plurality of unit optical fibers 11 and a metal sleeve 12 for bundling and bonding the insertion ends of the plurality of unit optical fibers 11 on the exit side. The light emitted from the laser diode 52 is incident on the unit optical fiber 11 through the lens 53 and the connector 51 provided for each unit optical fiber 11 . The light transmitted through each unit optical fiber 11 of the optical fiber bundle 10 is emitted from the output face 11A of each unit opti...

no. 2 example

[0038] FIG. 6 is a schematic view showing a state where an irradiation target 55 is irradiated with a light source device including an optical fiber bundle 20 according to a second embodiment of the present invention. FIG. 7 is a front view of the exit end face of the optical fiber bundle 20 . Like the first embodiment, the optical fiber bundle 20 constitutes a part of a light source device for manufacturing semiconductors.

[0039] The optical fiber bundle 20 includes a plurality of glass optical fibers 21 (second optical fibers), and further includes a plurality of unit optical fibers 11 (first optical fibers) and a metal sleeve 12 . The glass optical fiber 21 is made of the same glass as the unit optical fiber 11 and has better heat resistance than the adhesive 14 . The unit optical fiber 11 and the glass optical fiber 21 are substantially evenly arranged in the metal sleeve 12 , and are fixed on the sleeve 12 by curing the adhesive 14 throughout the entire length of the s...

no. 3 example

[0044] FIG. 9 is a front view of an exit end face of an optical fiber bundle 30 according to a third embodiment of the present invention. Like the first embodiment, the optical fiber bundle 30 constitutes a part of a light source device for manufacturing semiconductors. In the optical fiber bundle 30, the optical fiber is a metal-coated optical fiber 31 in which a metal coating constituting a filler is provided on the outer peripheral surface of the optical fiber. Different from the first embodiment, the space between the metal-coated optical fibers 31 in the sleeve 12 is filled with adhesive 14 over the entire length of the sleeve 12, so that the metal-coated optical fibers 31 and the sleeve 12 integrate.

[0045] FIG. 10 is a perspective view showing the metal-coated optical fiber 31 . The metal-coated optical fiber 31 coats the outer peripheral surface of the cladding 31A with a metal 32 such as aluminum, gold, silver, etc. that has high thermal conductivity and can be pl...

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Abstract

A fiber bundle is provided which has various advantages: limitation in terms of heat-resistant temperature is less; its manufacturing is easy and low-cost; and it will not degrade the optical fiber properties. The fiber bundle 10, which transmits through element fibers 11 light incident from light sources and emits the light from the respective output surface 11 A altogether, has a structure in which at least one end parts of the element fibers 11 are collectively inserted into a metal sleeve 12 and the one end parts are solidified to be united with the sleeve 12, and in which a metal 13, that is a filler, is filled among the element fibers 11, in the sleeve 12, over a region of a given length L in the longitudinal direction of the sleeve 12 from the emitting-end face 12 A of the sleeve 12.

Description

technical field [0001] The present invention relates to an optical fiber bundle and a light source device including the same, which can output high output light by collecting light from a plurality of light sources, and which can be used as a component of a laser exposure device, a laser processing device, etc. Optical transmission device. Background technique [0002] At present, optical processing technology has been widely used, and there are more and more opportunities to use optical fiber bundles bundled by multiple optical fibers to transmit light with high power density. Typically, conventional fiber optic bundles use adhesives to secure the ends of multiple optical fibers. However, when reflected light from an irradiated object (for example, a workpiece as a processing target) returns to the end face of the fiber bundle, there are cases where the adhesive absorbs light energy so that the temperature rises above the heat-resistant temperature, resulting in High temp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/04
CPCG02B6/4249G02B6/4296G02B6/04
Inventor 远藤壮一中野浩二畑山均
Owner SUMITOMO ELECTRIC IND LTD