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Installation system for electronic circuit device

A technology for electronic circuits and installation systems, applied in the direction of electrical components, electrical components, etc., can solve problems such as reducing production efficiency, and achieve the effect of inhibiting the reduction of production efficiency

Active Publication Date: 2012-03-28
FUJI KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the installation of electronic circuit components carried out by one reciprocation between the component supply device of the multi-nozzle head and the substrate holding device is set as one installation operation, the more times of installation operations after the adsorption error occurs, the more the multi-nozzle head is used. The more redundant reciprocating times due to correction increase, thereby reducing production efficiency

Method used

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  • Installation system for electronic circuit device
  • Installation system for electronic circuit device
  • Installation system for electronic circuit device

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Embodiment

[0057] Hereinafter, embodiments of the claimable invention will be described in detail with reference to the drawings. Among them, the claimable invention can be implemented in various modified embodiments based on the embodiments described in the above "Summary of the Invention" in addition to the following examples, based on the knowledge of those skilled in the art.

[0058] exist figure 1 An electronic circuit component mounting system as an embodiment of the claimable invention is schematically illustrated. like figure 1 As shown, the electronic circuit device mounting system includes a substrate conveying device 10 as a substrate conveying device, a feeding type device supplying device 12 and a tray type device supplying device 14 as a kind of device supplying device, and a substrate holding device as The substrate holding device 16, the mounting device 18, the nozzle head housing device 20 and the control device 22 (refer to Image 6 ).

[0059] The substrate convey...

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PUM

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Abstract

An electronic circuit device mounting system is provided, capable of restraining production efficiency from decreasing, and capable of processing to correct the electronic circuit device generating mounting error. When mounting the electronic circuit device by a single suction nozzle head holding one suction nozzle, under the situation of generating mounting error, then at once leading the mounting device to process again mounting action for non-mounting electronic circuit device; when mounting the electronic circuit device by a plurality of suction nozzle heads holding a plurality of suctionnozzles, and predetermined condition establishment, leading the mounting device to central process again mounting action of the non-mounting electronic circuit device due to the mounting error generated before the time. When mounting at least by a plurality of sucking nozzle heads processing on the one circuit substrate electronic circuit device, predetermining mounting end of all electronic circuit device except the electronic circuit device generating mounting error in the electronic circuit device mounted by a plurality of suction nozzle heads, and central processing to correct before processing change shortly.

Description

technical field [0001] The present invention relates to an electronic circuit device mounting system, and more particularly to correction when an error occurs in the mounting of an electronic circuit device to a circuit base material. Background technique [0002] In the electronic circuit component mounting system, when the suction nozzle receives the electronic circuit component from the component supply device and mounts it on the circuit substrate, mounting errors may occur. For example, even though the suction nozzle has already carried out the suction operation of the electronic circuit component, there may be a suction error that the electronic circuit component is not picked up, and the suction nozzle that missed the suction cannot mount the electronic circuit component on the circuit substrate, resulting in a mounting error. For this reason, in the electronic circuit component mounting system described in the following Patent Document 1, when a suction error occurs,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K13/04
Inventor 矶村公夫石川一真加藤刚田代政幸
Owner FUJI KK