Protruding electrode for connecting electronic component, electronic component mounted body using such electrode and methods for manufacturing such electrode and electronic component mounted body
A technology of electronic parts and manufacturing methods, applied in the field of electronic parts mounting body
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no. 1 approach
[0113] Figure 1A is a plan view of an electronic component having a protruding electrode in the first embodiment of the present invention, Figure 1B yes Figure 1A The A-A line profile.
[0114] exist Figure 1A Among them, the protruding electrodes 120 are formed on the terminal electrodes 110 of the electronic component 100 such as a semiconductor chip. Again, if Figure 1B As shown, the protruding electrode 120 is composed of the first conductor 130 on the side of the terminal electrode 110 of the electronic component 100 and the second conductor 140 stacked thereon. Furthermore, as shown in the following manufacturing method, since the protruding electrodes 120 are formed using a transfer mold having recesses, they can be formed at a fine pitch and can be formed at a uniform height.
[0115] Here, the first conductor 130 is made of a conductive resin including a conductive filler, a thermosetting resin, and the like. As the conductive filler, for example, metal par...
no. 2 approach
[0135] Figure 3A is a plan view of a substrate having protruding electrodes in a second embodiment of the present invention, Figure 3B yes Figure 3A The A-A line profile.
[0136] exist Figure 3A Among them, the protruding electrodes 120 are formed on the wiring electrodes 220 of the substrate 200 having the wiring pattern 210 . Furthermore, the protruding electrodes 120 are constituted by the first conductor 130 on the wiring electrode 220 side of the substrate 200 and the second conductor 140 stacked thereon, as in the first embodiment. Here, as the substrate 200, a glass epoxy substrate obtained by impregnating glass cloth with an epoxy resin, a thermosetting material such as PET (polyethylene terephthalate) resin or polyimide can be used. Organic substrates such as resins or inorganic substrates such as ceramics. In addition, when an organic substrate such as PET is used as the substrate 200, as the second conductor 140 of the protruding electrode 120, in order to...
no. 3 approach
[0139] Figure 4 It is a cross-sectional view of the electronic component package in the third embodiment of the present invention.
[0140] exist Figure 4 In this embodiment, the electronic component package 250 is formed by connecting the protruding electrodes 120 formed on the wiring electrodes 220 of the substrate 200 of the second embodiment to the terminal electrodes 110 of the electronic component 100 such as a semiconductor chip. In this case, the terminal electrode 110 of the electronic component 100 is connected to the second conductor 140 of the protruding electrode 120 .
[0141] That is, since the second conductor 140 can be connected to the terminal electrode 110 of the electronic component 100 in a thermally bonded state described below, reliable connection can be realized. Furthermore, since the curing temperature of the first conductor 130 is lower than that of the second conductor 140 , the first conductor 130 will not be deformed at the curing temperature...
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