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Heat radiating module and fan thereof

A cooling module and fan technology, which is applied in cooling/ventilation/heating transformation, instrument cooling, and instrumentation, etc., can solve problems such as lower reliability and pass rate, higher cooling module cost, and increased number of assembly and manufacturing processes.

Inactive Publication Date: 2008-04-16
DELTA ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, since this kind of heat dissipation module requires steps of aligning and assembling the support frame and the fan, the support frame and the heat sink, and the fan and heat sink, the number of assembly and manufacturing processes of the entire heat dissipation module increases, and the demand for alignment accuracy increases. , which in turn causes the cost of the entire cooling module to rise instead of falling, and the reliability and qualification rate are also greatly reduced

Method used

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  • Heat radiating module and fan thereof
  • Heat radiating module and fan thereof
  • Heat radiating module and fan thereof

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Embodiment Construction

[0037] figure 1 It is a schematic diagram of the fan 100 according to the first preferred embodiment of the present invention. Please refer to figure 1 , the fan 100 has a fan frame 112 and an impeller 102 . The fan frame 112 has a body 108 and at least one extension 110, wherein the extension 110 protrudes from at least one side of the body 108, more specifically, the extension 110 axially protrudes from at least one side of the body 108 .

[0038] The extension part 110 and / or the main body 108 are used to connect with the circuit board 208 described later, and the main body 108 and the extension part 110 are integrally formed. Also, the fan frame is made of non-metallic material, wherein the non-metallic material is plastic, rubber or polymer material.

[0039] The main body 108 can be ring-shaped, and the cross-sectional shape of the extension part 110 in the axial direction of the main body 108 can be columnar, plate-shaped, L-shaped, U-shaped, O-shaped or D-shaped. ...

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Abstract

The invention discloses a heat dissipating module, including a fan and at least one radiator. The fan is provided with a fan frame and an impeller. The fan frame is provided with a body and at least one extending part, wherein the extending part is protrudent from at lease one side of the body. The extending part is used for being connected with a circuit board. The impeller is contained inside the body. The radiator is connected with the extending part and is used for leading out the heat produced by at least one electronic element of the circuit board.

Description

technical field [0001] The invention relates to a heat dissipating module and its fan, in particular to a heat dissipating module and its fan which can be directly connected to a circuit board through a fan frame. Background technique [0002] In today's electronic systems, since there are electronic components that generate heat on the circuit board, a heat dissipation module is often used to dissipate heat from the electronic components. The existing cooling module is divided into a radiator and a fan, wherein the fan is fixed on the radiator, and the cooling module is fixed on the circuit board by the radiator. [0003] However, since the material of the entire heat sink must be metal, and the fixing seat for fixing the heat sink to the circuit board must also be made of the same material as the heat sink, the material cost of the entire heat dissipation module remains high. [0004] In order to reduce the cost of the entire heat dissipation module, another existing heat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H05K7/00G12B15/00
Inventor 柯皓文雷宗玙黄文喜
Owner DELTA ELECTRONICS INC
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