The invention discloses a method for eliminating
solder mask ink in a via hole of a
printed circuit board, which comprises the steps of S1, cleaning a substrate and a conductive
copper layer on the surface of the substrate, roughening the surface of the conductive
copper layer through a
polishing device, and cleaning the substrate and the conductive
copper layer again; S2, carrying out silk-screenprinting, specifically, printing an ink layer with a preset color on the conductive copper layer; S3, conducting pre-baking, specifically, pre-baking the silk-screen
printed circuit board; S4, performing primary
exposure, specifically, performing alignment
exposure by using a film, performing photocuring on the
solder mask ink, and shielding the via hole and the periphery by using a shading partof the film; S5, developing for the first time, and removing the ink at the position shielded by the shading part of the film; S6,
drying the circuit board. S7, performing secondary
exposure, specifically, performing secondary alignment exposure by using a film, and performing secondary photocuring on the ink layer; S8, developing for the second time, and removing the residual solder
resist ink inthe via hole; and S9,
drying the circuit board. The
solder mask ink in the via hole can be effectively eliminated, the integrity of an ink layer is ensured, and
assembly welding bridge partition is prevented.