Exposure method for color film substrate

Abstract

The invention discloses an exposure method for a color film substrate. The method comprises the following steps of S1, providing a substrate, forming black matrix layers at intervals on an upper surface of the substrate, and taking a region without the black matrix layers as an opening region; S2, covering an upper surface of the opening region of the substrate and an upper surface of the black matrix layer with a negative photosensitive adhesive layer; S3, providing a mask version body of which the upper surface is provided with a shielding layer, forming the mask version body below the substrate, and arranging the shielding layer towards the substrate; and S4, exposing light beams perpendicular to a plane of a mask plate penetrating through the region, not provided with the shielding layer, of the mask plate body from the lower portion of the mask plate body, and the photosensitive adhesive layer so that the color filter layer is formed through the process including development. Themethod is advantaged in that the mask plate is formed on a lower surface of the substrate, the shading property of a black matrix layer on an upper surface of the substrate is utilized, so segment difference is eliminated, and the precision requirement of the mask plate and the alignment precision requirement of an exposure machine are reduced.

Description

technical field [0001] The invention relates to the technical field of manufacturing a color filter substrate in a liquid crystal display, and more particularly relates to an exposure method for a color filter substrate. Background technique [0002] Such as figure 1 As shown, a liquid crystal display generally includes an array substrate and a color filter substrate arranged in a box, wherein the color filter substrate includes a base, a black matrix (BM) layer on the base, a color filter layer (RGB) on the black matrix layer and the base ), and an insulating film layer (OC) on the color filter layer, wherein the color filter layer fills the opening area of ​​the black matrix layer. The production of the color film substrate is usually to first make a black matrix layer on the base, and then apply RGB glue on the basis of the black matrix layer. The illuminated part is removed, and then the light-shielding layer of the mask is used to determine the remaining part and the ...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, a high-precision mask is used to expose the color filter layer from one side of the black matrix layer (the front side of the substrate). Due to process fluctuations and mechanical errors in actual operation, the accuracy cannot reach 100%. In order to completely cover the black matrix In the opening area of ​​the layer, the exposed area needs to be larger than the opening area of ​​the black matrix layer, which leads to the residual RGB PR glue on the upper surface of the black matrix layer close to the opening area (usually called Data line and Gate line), The formation of a high level difference is not conducive to post-process processing, so it is necessary to add an additional OC flat layer

[0004] Therefore, in order to reduce the step difference, the precision of the mask plate needs to be higher, otherwise there will be a risk of light leakage; if the step difference is particularly large, it will cause the problem that it cannot be completely flat even if the OC flat layer is added

If the thickness of the OC flat layer is increased to improve the flat effect, the cost will increase and the transmittance will increase

In addition, the method of front-side exposure of the substrate may also cause undercut phenomenon after the development of the color filter layer. The undercut phenomenon means that when exposed from the front, the upper and lower parts of the RGB adhesive layer have less curing strength than the upper part due to the exposure intensity. Strong, the phenomenon that the lower part is hollowed out after developing

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