Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor storage apparatus and semiconductor integrated circuit incorporating the same

一种存储装置、集成电路的技术,应用在半导体器件、半导体/固态器件制造、电路等方向,能够解决丧失存储功能等问题,达到提高利用效率、柔软性高、抑制电位变动的效果

Inactive Publication Date: 2010-04-21
PANASONIC CORP
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the aforementioned DRAM of the prior art, the potentials of the bit lines and the word lines connected to the memory cells used as bypass capacitors are fixed, so these memory cells completely lose their original storage function (storing bit information). ability)

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor storage apparatus and semiconductor integrated circuit incorporating the same
  • Semiconductor storage apparatus and semiconductor integrated circuit incorporating the same
  • Semiconductor storage apparatus and semiconductor integrated circuit incorporating the same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0025] The semiconductor integrated circuit 100 according to the first embodiment of the present invention is preferably an LSI system, and includes a power supply line 120, a logic circuit unit 401, a memory control unit 402, and a semiconductor storage device (hereinafter referred to as “memory core unit”) 410. (refer to Figure 4 ). The power supply line 120 is maintained at a constant power supply potential VDD, and supplies power to each part in the semiconductor integrated circuit 100 . The logic circuit unit 401 is preferably a CPU system, and is connected to each unit in the semiconductor integrated circuit 100 by an internal bus. The logic circuit section 401 executes various programs (refer to Figure 5 ) to control the operation of each part in the semiconductor integrated circuit 100.

[0026] The memory control unit 402 is particularly connected to the memory core unit 410 by an internal bus, and is connected to an external memory M arranged outside the semicon...

no. 2 Embodiment approach

[0039] The semiconductor integrated circuit according to the second embodiment of the present invention has the same structure as the semiconductor integrated circuit 100 according to the first embodiment of the present invention except for the inside of the memory block contained in the memory core portion 410 . For the details of these same constituent elements, refer to the relevant description of the first embodiment and Figure 4 .

[0040] The memory block 320 preferably has a memory cell 301, word lines 110, 112, . . . , bit lines 114, 115, 116, . image 3 ). The memory cells 301 are preferably arranged in a lattice to form a memory cell array. Word lines 110, 112, . Preferably, one selection signal line 310 is included in each memory block 320 and is provided in parallel with the power supply line 120 . The 3rd transistor 302,303,304,..., preferably MOSFET, its gate is connected with identical selection signal line 310, and source is connected with identical power ...

no. 3 Embodiment approach

[0045] The semiconductor integrated circuit according to the third embodiment of the present invention has the same structure as the semiconductor integrated circuit 100 according to the first embodiment of the present invention except for the selection signal line and the memory core portion 410 . For the details of these same constituent elements, refer to the relevant description of the first embodiment and figure 1 , Figure 4 .

[0046] In the semiconductor integrated circuit according to the third embodiment of the present invention, unlike the semiconductor integrated circuit according to the first embodiment, a register 415 is provided inside the memory core unit 410 (see Figure 6). Furthermore, instead of the selection signal lines 421, 422, 423, 424 connected between the memory control unit 402 and the memory blocks of the memory core unit 410 (see Figure 4 ), selection signal lines 431, 432, 433, 434 connected between the register 415 and each memory block. T...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A semiconductor storage apparatus wherein the number of memory cells used as bypass capacitors can be dynamically changed. In each memory block, a selector signal line is provided in parallel with each word line. In a pair of word line and selector signal line adjacent to each other, the states thereof are maintained such that they are opposite to each other. Additionally, in each memory block, abranch of a power supply line is provided in parallel with each bit line. In each memory cell, a first transistor connects a capacitor to the bit line in accordance with the state of the word line, while a second transistor connects the same capacitor to the power supply line branch in accordance with the state of the selector signal line. In the memory cells aligned in the row direction, the gatesof the first transistors are connected to the same word line, while the gates of the second transistors are connected to the same selector signal line.

Description

technical field [0001] The present invention relates to a semiconductor memory device, and more particularly to a semiconductor memory device mounted on a semiconductor integrated circuit. Background technique [0002] A dynamic semiconductor memory device (DRAM) is easy to be highly integrated and large in capacity. In recent years, DRAM (hybrid DRAM), which is integrated with logic circuits on the same chip, has been widely used. Since the data transmission speed of the hybrid DRAM is particularly high, it is suitable for a system LSI (such as a graphics LSI) that performs high-speed calculation and communication of a large amount of data. On the other hand, compared with ordinary DRAM, the manufacturing process of hybrid DRAM is complicated. As a conventional technique for simplifying the manufacturing process of a hybrid DRAM, for example, the following techniques are known (for example, refer to Patent Document 1). In the DRAM employing this prior art, a part of the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G11C11/401H01L27/108H01L21/8242H01L27/10
CPCG11C11/4074H01L27/10882H01L27/101H01L27/1085G11C11/404G11C11/4076H10B12/03H10B12/48G11C5/063G11C7/18G11C8/14G11C11/4096
Inventor 高桥英治齐藤义行
Owner PANASONIC CORP