Semiconductor storage apparatus and semiconductor integrated circuit incorporating the same
一种存储装置、集成电路的技术,应用在半导体器件、半导体/固态器件制造、电路等方向,能够解决丧失存储功能等问题,达到提高利用效率、柔软性高、抑制电位变动的效果
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no. 1 Embodiment approach
[0025] The semiconductor integrated circuit 100 according to the first embodiment of the present invention is preferably an LSI system, and includes a power supply line 120, a logic circuit unit 401, a memory control unit 402, and a semiconductor storage device (hereinafter referred to as “memory core unit”) 410. (refer to Figure 4 ). The power supply line 120 is maintained at a constant power supply potential VDD, and supplies power to each part in the semiconductor integrated circuit 100 . The logic circuit unit 401 is preferably a CPU system, and is connected to each unit in the semiconductor integrated circuit 100 by an internal bus. The logic circuit section 401 executes various programs (refer to Figure 5 ) to control the operation of each part in the semiconductor integrated circuit 100.
[0026] The memory control unit 402 is particularly connected to the memory core unit 410 by an internal bus, and is connected to an external memory M arranged outside the semicon...
no. 2 Embodiment approach
[0039] The semiconductor integrated circuit according to the second embodiment of the present invention has the same structure as the semiconductor integrated circuit 100 according to the first embodiment of the present invention except for the inside of the memory block contained in the memory core portion 410 . For the details of these same constituent elements, refer to the relevant description of the first embodiment and Figure 4 .
[0040] The memory block 320 preferably has a memory cell 301, word lines 110, 112, . . . , bit lines 114, 115, 116, . image 3 ). The memory cells 301 are preferably arranged in a lattice to form a memory cell array. Word lines 110, 112, . Preferably, one selection signal line 310 is included in each memory block 320 and is provided in parallel with the power supply line 120 . The 3rd transistor 302,303,304,..., preferably MOSFET, its gate is connected with identical selection signal line 310, and source is connected with identical power ...
no. 3 Embodiment approach
[0045] The semiconductor integrated circuit according to the third embodiment of the present invention has the same structure as the semiconductor integrated circuit 100 according to the first embodiment of the present invention except for the selection signal line and the memory core portion 410 . For the details of these same constituent elements, refer to the relevant description of the first embodiment and figure 1 , Figure 4 .
[0046] In the semiconductor integrated circuit according to the third embodiment of the present invention, unlike the semiconductor integrated circuit according to the first embodiment, a register 415 is provided inside the memory core unit 410 (see Figure 6). Furthermore, instead of the selection signal lines 421, 422, 423, 424 connected between the memory control unit 402 and the memory blocks of the memory core unit 410 (see Figure 4 ), selection signal lines 431, 432, 433, 434 connected between the register 415 and each memory block. T...
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