High viscosity fluid microscale spraying glue dropping machine

Abstract

The invention provides a high viscosity fluid slight injection dispensing device; the upper end of a driving mechanism is connected with a stroke and preloading governor mechanism, while the lower end is connected with an injection mechanism; the lateral part of the injection mechanism is connected with a feeding mechanism, a valve stem and a spay head which is arranged at the lower end of the valve stem are arranged in the interior of the injection device; the spray head consists of the valve stem, a valve seat and a nozzle. The valve stem and the valve seat are separated under the effect of the driving mechanism when dispensing; the space formed when the valve stem departed from the valve seat is filled by fluid under the effect of the feeding pressure; after that, compressed air is released; under the action of the stroke and preloading governor mechanism, the fluid around the valve stem and in the valve seat flows to the nozzle with a certain speed; finally when the valve stem and the valve seat are fully contacted and closed, the fluid stops flowing to the nozzle; the fluid flowing out of the nozzle is separated from the fluid in the valve seat to form the droplet with a certain speed. The invention implements the distribution of high viscosity fluid material and has the advantages of no contacts, high precision, high reliability, low cost, etc.

Description

technical field [0001] The invention relates to microelectronic packaging technology, in particular to high-viscosity fluid micro-injection technology. Background technique [0002] In microelectronic packaging, the surface coating of encapsulant is a very important process, which is widely used in the subsequent packaging process of integrated circuit manufacturing. The dispensing technologies currently used for encapsulants are mainly divided into two categories: contact type represented by screen printing and needle tube transfer, and non-contact type represented by jetting technology. Most of the encapsulation adhesives used in microelectronic packaging are high-viscosity non-Newtonian fluids, whose complex and changeable characteristics make it difficult to guarantee the coating performance and quality of encapsulation adhesives by contact dispensing. With the transfer of the global semiconductor industry to China, the domestic electronic packaging industry is booming,...

AI Technical Summary

Problems solved by technology

However, these dispensing technologies are all contact dispensing technologies, which are suitable for medium-viscosity colloids. The size of the dispensing volume is affected by the gas pressure or motor running time, the geometric parameters of the screw and its matching size with the glue supply chamber, the characteristics of the glue, The influence of parameters such as the distance between the needle and the substrate

At present, the research on high-viscosity fluid micro-injection technology for microelectronic packaging is still blank

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