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Exposing method and device

An exposure method and technology of an exposure device, applied in the direction of an exposure method using an optical device, a radiation-sensitive mask, a measurement device, etc., which can solve the problems of increased photomask replacement time, increased cost, and decreased productivity.

Active Publication Date: 2010-06-16
SANEI GIKEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0021] In the above-mentioned conventional exposure method, even if the allowable transfer accuracy is maintained, there are many problems such as an increase in cost due to the production of a plurality of photomasks, and a decrease in productivity due to an increase in the replacement time of the photomask.

Method used

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Examples

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Embodiment Construction

[0066] image 3 A state where the substrate 1 and the photomask 2 having the same length L are planarly contacted and overlapped is shown. A pattern is drawn on one main surface 2A of the photomask 2 . The thickness T2 of the generally used glass photomask 2 is about 5 mm, and when the board|substrate 1 is a printed circuit board, the thickness T1 is often 1 mm or less. In addition, the center line 2C of the thickness T2 of the photomask 2 is shown by the dashed-dotted line.

[0067] Figure 4 The state where the substrate 1 and the photomask 2 are in uniform contact with each other and overlapped is shown, and the state where the substrate 1 side of the photomask 2 becomes concave and both the photomask 2 and the substrate 1 are curved. As shown in the figure, the thickness T2 of the photomask 2 is relatively thick, so the photomask 2 in the curved state takes the center line 2C of the thickness T2 as a boundary line, and the substrate 1 side is shortened, and the opposite...

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Abstract

An exposing method and an exposing device for transferring a pattern written on a photomask to a substrate. The photomask is arranged at a position covering a substrate. The photomask and the substrate touch each other uniformly to create a state of being deformed concavely or convexly to each other. Under that state, a photosensitive layer on the substrate is irradiated with light through the photomask, thus transferring a pattern having substantially changed dimensions onto the substrate.

Description

technical field [0001] The present invention relates to an exposure method and an exposure device in which a photomask on which a pattern is drawn and a substrate on which a photosensitive layer is formed on the surface are stacked, and the substrate is irradiated with light through the photomask to transfer the pattern to the substrate. More specifically, the present invention relates to a method of aligning a photomask and a substrate. Background technique [0002] Conventionally, in order to form a conductive pattern on the surface of a printed circuit board or the like, it has been widely practiced to stack a substrate having a photosensitive layer formed on the surface and a photomask on which a pattern is drawn, and to irradiate the substrate with light through the photomask to transfer the pattern. A method of exposing a photosensitive layer printed onto a substrate surface. [0003] In this exposure method, in order to transfer the pattern drawn on the photomask to ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01B11/00G03F9/00H01L21/027H01L21/68
CPCG03F1/144G03F7/2014G03F7/24G03F1/14G03F7/7035H05K3/0082G03F7/70783G03F1/50G03F1/38G03F1/62
Inventor 桥本博信高木俊博三宅健
Owner SANEI GIKEN