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Optical mask employed for manufacturing array substrate, array substrate and method for manufacturing the same

A technology for array substrates and manufacturing methods, applied in the field of photomasks, capable of solving problems such as inability to correctly inspect array substrates

Active Publication Date: 2008-06-25
INFOVISION OPTOELECTRONICS HLDG LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, if the wiring overlaps in the double exposure region 334, it will also be connected to the inspection point included in the array substrate 291 that does not want to be connected to the inspection pad, so the array substrate cannot be inspected correctly using the inspection pad 361. 281

Method used

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  • Optical mask employed for manufacturing array substrate, array substrate and method for manufacturing the same
  • Optical mask employed for manufacturing array substrate, array substrate and method for manufacturing the same
  • Optical mask employed for manufacturing array substrate, array substrate and method for manufacturing the same

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Embodiment Construction

[0073] Embodiments of the present invention will be described below with reference to the drawings.

[0074] 4 is a schematic plan view illustrating a mother glass substrate on which an array substrate produced by using the photomask is arranged for explaining the photomask (hereinafter also referred to as "this photomask") according to the embodiment of the present invention.

[0075] In FIG. 4 , 101 is a mother glass substrate, 381 is an upper vertical wiring made by using this photomask, and 391 is a lower vertical wiring made by using this photomask.

[0076] FIG. 5 is an enlarged view of part 421 in FIG. 4 .

[0077] In FIG. 5 , 391 is the lower up-and-down wiring formed by exposing the exposure area 202 , 501 is the U-turn portion facing the border, 511 is the U-turn portion facing the center, and 382 is the upper portion formed by exposing the exposure area 203 The wiring 333 running up and down is a double exposure region in which the exposure of the exposure region 2...

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PUM

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Abstract

The invention provides wiring, which can form or disconnect freely the adjacent exposure regions by employing the same optical mask under a condition that a plurality of array substrates are produced on one mother glass substrate; and an optical mask, which can be inspected by utilizing the same probe device for inspecting even though under a condition that the same mother glass substrate is used to produce the array substrates with different sizes; array substrates; and the manufacture method of the same. The solution means is: the above optical mask is formed to allow: the wiring in upper section at up and down direction is formed in the upper end section of the array substrate, and the wiring in lower section at up and down direction is formed in the lower end section; and a "U shape turning section towards the boundary", which is turned in a U shape to the boundary at the lower end side of said array substrate, is formed, and a "U shape turning section towards the center", which is turned again in a U shape to the center section of said array substrate, is formed.

Description

technical field [0001] The invention relates to a photomask for making an array substrate of a liquid crystal display device, an array substrate and a manufacturing method thereof. Background technique [0002] Array substrates used in liquid crystal display devices are usually made of multiple array substrates from a large mother glass substrate, that is, multiple array substrates are obtained from one mother glass substrate. When each array substrate is inspected in a state where the array substrate is manufactured from the mother glass substrate, the inspection is performed by electrically contacting inspection pads provided around the mother glass substrate with inspection probes. In this case, even if the size of the array substrate or the number of array substrates obtained from one mother glass substrate is different, the same inspection probe can be used as long as the positions of the inspection pads provided around the mother glass substrate are the same. The devi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/00G02F1/136H01L27/12H01L21/027G02F1/13G02F1/1368G03F1/70
CPCG03F1/144H01L27/1288H01L27/1214G03F7/70791G03F1/00
Inventor 川野英郎砂山英树
Owner INFOVISION OPTOELECTRONICS HLDG LTD
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