LED lead frame and method for manufacturing LED using the lead frame

Abstract

The invention discloses an LED lead frame, and the lead frame is a plate type frame structure. The invention is characterized in that a plate type frame is formed by arranging convex plates which are extended towards the middle part and mutually spaced in a peripheral frame, the convex plates respectively form a chip holding part, an inner lead connecting part, an outer electrode part and a pipe body supporting part, the peripheral frame forms a connecting base plate, the inner lead connecting part and the chip holding part are positioned at the front end of the outer electrode part, and the chip holding part is provided with a reflecting cavity. Simultaneously, the invention discloses a method for manufacturing an LED by adopting the lead frame, a process that encapsulating colloid is injected and moulded is adopted to cause the LED chip to be capsulated, and after a pin and an electrode outside the LED is punched and bent, the LED is separated from the base plate of the lead frame into an independent device. The invention has the advantages that the structure is simple, the LED lead frame is easy to be installed, and the consistency of the product is good.

Description

technical field [0001] The patent of the present invention relates to a light-emitting diode (LED) technology, in particular to a LED manufacturing technology, specifically a lead frame structure and a method for manufacturing an LED by using the lead frame. Background technique [0002] figure 1 and figure 2 Represents the known composition and structure diagram of LED, and respectively represents the two types of LED manufacturing methods commonly used at present [0003] figure 1 It is a PLCC type LED launched in recent years. This structure belongs to the surface mount type, and has the advantages of high assembly precision, high density, and high production efficiency. Its main components include lead frame 101, LED chip 102, connecting lead 103, encapsulation compound 104, reflective cavity 105, and lens 106. Lead wires 103 , and finally place the encapsulant 104 and the lens 106 . This type of LED generally has a reflective cavity 105 to facilitate the packaging...

AI Technical Summary

Problems solved by technology

However, when used for a long time, especially for applications with harsh conditions such as outdoors, the phenomenon of delamination between the encapsulating colloid 104 and the reflective cavity 105 often occurs, thereby affecting the quality of the product, and this type of product is greatly restricted.

[0004] figure 2 It is a traditional bracket-type LED structure, which has the advantages of simple manufacturing process, but in the process of use, due to its own structural characteristics, it is often difficult to control the consistency of the final product, heat dissipation, assembly density and other characteristics Incomparable with SMD LED

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