Thermosetting compound, composition containing the same, and molding

Abstract

A thermosetting compound improved in dielectric properties, especially dielectric constant and dielectric loss, over those of the prior art; a composition containing the same; and a molding thereof. There is provided a thermosetting compound consisting of any of dihydrobenzoxazine compounds of the formula: (2) wherein each of R6 to R13 is a hydrogen atom, alkyl, etc., and R14 is a divalent saturated alicyclic hydrocarbon group with condensed ring structure.

Description

Thermosetting compound, composition containing it, and molded body technical field The present invention relates to thermosetting compounds, compositions containing them and shaped bodies formed therefrom. Background technique For a long time, as thermosetting resins such as phenolic resins, melamine resins, epoxy resins, unsaturated polyester resins, and bismaleimides, they have been used in various industrial fields due to their excellent heat resistance and reliability. used in the application. Especially for thermosetting resins used in electronic materials (such as substrate materials), in order to cope with the high density (miniaturization) of electronic equipment and devices and the high speed of transmission signals in recent years, it is necessary to improve the dielectric properties (low dielectric properties) Electricity constant and low dielectric loss) to improve signal transmission speed and high frequency characteristics. As raw materials for thermosetti...

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Problems solved by technology

In addition, Patent Document 3 and Non-Patent Document 3 describe that when an aliphatic amine is used to form a resin having a benzoxazine ring, the heat resistance of the cured product is poor.

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