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Hardware protection in form of printed circuit board drawn into semi-case

A printed circuit board and hardware protection technology, which is applied to printed circuit components, three-dimensional rigid printed circuit boards, printed circuits, etc., can solve problems such as damage and high scrap rate

Inactive Publication Date: 2012-08-22
SIEMENS AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Another is that the film is often damaged during packaging, resulting in a high scrap rate

Method used

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  • Hardware protection in form of printed circuit board drawn into semi-case
  • Hardware protection in form of printed circuit board drawn into semi-case
  • Hardware protection in form of printed circuit board drawn into semi-case

Examples

Experimental program
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Embodiment Construction

[0022] exist figure 1 A hardware protection 10 with a flat substrate 11 , 12 with a concave central region 11 that is completely surrounded by a raised region 12 can be seen therein. Conductor structures 13 , 14 are arranged on and in substrates 11 , 12 . For this purpose, the substrate 11 , 12 contains two prepregs (Prepreg) 15 , 16 . The first prepreg 15 forms the face of the substrate 11 , 12 pointing in the direction of the depression of the central region 11 . The first conductor structure 13 of the two conductor structures 13 , 14 mentioned is arranged on the side of the prepreg 15 pointing in the direction of the protrusion of the region 12 surrounding the central region 11 .

[0023] Adjacent to the first prepreg, a second prepreg 16 is again arranged, on the side of which the second conductor structure 14 is arranged opposite the first conductor structure 13 .

[0024] The dongle 10 has a connection 17 for contacting the conductor structures 13 , 14 with other hard...

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PUM

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Abstract

The invention relates to hardware protection system for a circuit, which is to be protected, and which contains a substrate which comprises a recoiling area which is surrounded by protruding areas. Said hardware protection system is embodied, in particular, as half-shells. Said hardware protection system also comprises conductor structures which are arranged on and / or in the substrate in order todetect access to the circuit which is to be protected.

Description

technical field [0001] Electronic assemblies used for highly sensitive data processing and data protection, such as those used in tachometers for commercial motor vehicles, as well as in financial institutions, ATMs, aircraft, and anywhere sensitive data is handled, should In terms of hardware, external manipulation is prevented, such as chemical or physical attacks (such as machinery, laser, fire, etc.), so that data can not be manipulated. Background technique [0002] There is currently a solution in which the electronic components to be protected are completely encapsulated by means of so-called anti-drilling films. Such anti-drilling films are offered, for example, by the company Gore as end products, or by the company Freudenberg as films with silver paste printing. The film is inwardly connected electrically to the component. After the electronic component is three-dimensionally packaged, the electronic component is then sealed into a container with synthetic resin....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F21/00H05K1/02G06F21/86
CPCG06F21/86H05K2201/10151H05K1/144H05K1/0275H05K1/0268H05K1/0284
Inventor K·韦德纳A·威默
Owner SIEMENS AG