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Active part array base board and its making method

An array substrate and active element technology, which is applied in the field of manufacturing thin film transistor array substrates, can solve problems such as high difficulty, reduced element performance, and increased cost.

Active Publication Date: 2010-08-18
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the complexity of such a fabrication method is high, and each photomask pattern must be precisely aligned
In particular, with the trend of miniaturization of components, when multiple pattern alignments are involved in the process, the difficulty of the overall process is even higher; if the alignment of any photomask deviates, the manufactured components will be It will deviate from the original design, which will greatly reduce the performance of components, resulting in deterioration of yield and cost increase

Method used

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  • Active part array base board and its making method
  • Active part array base board and its making method
  • Active part array base board and its making method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0076] [step one]

[0077] Referring to FIG. 1 and FIGS. 2A to 2C , firstly, a patterned first metal layer 223 is formed on the substrate 221 . According to the present invention, the substrate 221 can be, for example, a glass substrate or a plastic substrate, and the patterned first metal layer 223 can be a single metal layer or a multiple metal layer; in this embodiment, the patterned first metal layer 223 is composed of an upper The metal layer 223a and the lower metal layer 223b are formed. The material of the upper metal layer 223a can be, for example, aluminum, and the material of the lower metal layer 223b can be, for example, titanium, molybdenum, or an alloy thereof.

[0078] A first metal layer (not shown) is first deposited by a chemical vapor deposition method, and then a first photomask process is performed using, for example, a binary photomask, so as to be placed on a predetermined position above the substrate 221, A patterned first metal layer 223 is formed as...

Embodiment approach 2

[0099] [step one]

[0100] Referring to FIGS. 9 and 10A to 10C, a first photomask process is performed on the substrate 321 to form a patterned first metal layer 323 as shown in FIG. 9 at a predetermined position above it. The method and materials are the same as the first step above, that is, depositing a first metal layer (not shown), and then performing a first photomask process to form a patterned first metal layer on a predetermined position of the substrate 321 .

[0101] In this manner, the patterned first metal layer 323 is a multi-metal layer, but not limited thereto, and is composed of an upper metal layer 323a and a lower metal layer 323b. As shown in FIG. 9 , the patterned first metal layer 323 of this mode also includes a plurality of gate wires 123 , a plurality of gates 122 connected to these gate wires 123 and a plurality of gate connection pads 121 , the cross-sectional views are shown in Figures 10A to 10C.

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Abstract

The invention provides an active element array base plate and a manufacturing method thereof. By forming a first patterning metal layer, an insulating layer, a patterning semiconductor layer and a patterning metal multiple layer, etc., the invention is taken as a film transistor inside the array base plate, a grid conducting wire, a grid connecting bonding pad, a data conducting wire, a data connecting bonding pad and a storage electrode, etc., a film layer configuration with undermining structure is formed by etching a given film layer selectively, thereby further reducing the number of times of the photomasking etching process which is complicated and time consuming in the array base plate manufacturing method and providing an array base plate with the relatively simple and time-saving technique steps.

Description

technical field [0001] The invention relates to an active element array substrate and a manufacturing method thereof, in particular to a manufacturing method of a thin film transistor array substrate capable of reducing the number of photomask procedures required for the process. Background technique [0002] Liquid crystal display (LCD) is widely used in portable TVs, mobile phones, and notebook computers due to its advantages of high image quality, small size, light weight, low voltage drive, low power consumption, and wide application range. In consumer electronics products such as desktop monitors, it has become the mainstream of monitors. [0003] A general liquid crystal display, taking a thin film transistor liquid crystal display as an example, is mainly composed of a thin film transistor array substrate, a color filter array substrate and a liquid crystal layer. Among them, the thin film transistor array substrate is composed of a plurality of thin film transistors...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/522H01L21/84G02F1/1362H01L21/768H01L27/12
Inventor 方国龙林祥麟林汉涂
Owner AU OPTRONICS CORP