Supersonic soldering aluminum coil and its production method

A manufacturing method and ultrasonic technology, applied in manufacturing tools, semiconductor/solid-state device manufacturing, welding equipment, etc., can solve the problems of complicated operation procedures, increased welding defect rate, environmental pollution, etc.

Active Publication Date: 2012-03-07
南通迪皮茜电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Due to the different characteristics of the aluminum wire and the copper foil of the printed circuit board, there is a phenomenon that it is not easy to solder and connect. In order to improve its adhesion during soldering, it is necessary to use flux. However, the use of flux will bring environmental pollution and cause copper foil Deformation, which increases the welding defect rate
[0006] Although electroplating can also be performed on-line, it still causes environmental pollution due to the use of a large amount of chemicals
[0007] Therefore, after crimping the connecting pins containing a large amount of copper to the end of the aluminum coil, inserting the above connecting pins into the printed circuit board and soldering them is complicated and requires a lot of time and cost.

Method used

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  • Supersonic soldering aluminum coil and its production method
  • Supersonic soldering aluminum coil and its production method
  • Supersonic soldering aluminum coil and its production method

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Embodiment Construction

[0026] The present invention will be further described below with reference to the accompanying drawings and examples. In describing the present invention, if a specific description of known related content or functions may obscure the gist of the present invention, the detailed description will be omitted.

[0027] According to the ultrasonic brazing aluminum coil manufacturing method of the preferred embodiment of the present invention, the present invention includes the following steps: the first step (S10), such as figure 1 The coating substance (12) at the end of the clear wire coil (10) shown; the second step (S20), ultrasonic brazing is carried out to the end of the wire (11) that has removed the coating substance (12) and forms a solder gold-plated layer (20).

[0028] In the first step (S10), the coating substance (12) at the end of the wire coil (10) coated with an insulating substance such as enamel or epoxy resin is removed, although the coating substance (12) can...

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Abstract

The invention provides an aluminium wire coil made by ultrasonic soldering and manufacturing method thereof. The invention plates on surface of wire by ultrasonic soldering so as to improve soldering force between the printed circuit board and copper foils and ensure the conductive property, omit pretreatment of soldering and increase work efficiency and production efficiency, prevent environmental pollution caused by using flux. The invention provides an aluminium wire coil made by ultrasonic soldering, comprising steps of forming insulating coating on surface of aluminium wire, dipping a wire end on which the coating is removed into a solder box applied ultrasonic wave to form a solder plated layer by ultrasonic soldering.

Description

technical field [0001] The present invention relates to an ultrasonic brazing aluminum wire coil and its manufacturing method. In more detail, the present invention utilizes ultrasonic soldering (soldering) to form solder (solder) metallization on the surface of the wire to improve the distance between the wire and the copper foil of the printed circuit board. Solder bonding strength between solder and ensure electrical conductivity, omit soldering pre-treatment process and improve work efficiency and productivity, can prevent environmental pollution caused by the use of flux (Flux). Background technique [0002] Generally speaking, a printed circuit board (PCB: Printed Circuit board) is a copper-clad laminate made by uniformly and firmly adhering a micron-thick electrolytic copper foil board to a plastic laminate as its material. The resistor (resistor) of the required wiring pattern is printed on it, and then the unnecessary copper foil is removed by etching, and then the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R4/02H01R43/02H01R43/28B23K1/06B23K1/08B23K1/19H01L21/60H05K3/30
CPCH01L2924/0002H01L2924/00H05K3/30
Inventor 林白云卞长孝金大权金太守
Owner 南通迪皮茜电子有限公司
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