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Electret capacitor microphone

A technology of condenser microphone and electret, applied in electret electrostatic transducer, electrostatic transducer microphone, electrostatic sensor, etc., can solve the problems of high cost, complicated wiring, complicated operation, etc.

Inactive Publication Date: 2008-11-26
CITIZEN ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in the case of the ECM90, wiring of connecting wires (not shown) for connecting the vibrating membrane 7 and the electret layer 5 to the circuit board 2 becomes complicated.
That is to say, since the vibrating membrane 7 has a conductive film on the surface, and the vibrating membrane supporting frame 6a also has conductivity, the conductive wire connecting the electret layer 5 and the circuit substrate 2 must be connected to the vibrating membrane 7 and the vibrating membrane 7 and the vibrating membrane between them. The film support frame 6a is insulated and wired, and the operation is complicated and the cost becomes high

Method used

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Embodiment Construction

[0033] First of all, the ECM of the first embodiment of the present invention will be described with reference to FIGS. 1 to 6, and the above-mentioned Figure 8 and Figure 9 The same structural elements of the ECM are described by attaching the same reference numerals.

[0034] The ECM of this embodiment is configured by stacking circuit board 2 , spacer 8 , diaphragm unit 6 including conductive diaphragm support frame 6 a , and electret substrate 3 sequentially, and housed in a metal shield case 85 . The above-mentioned electret substrate 3 is constituted by providing an electret layer 5 on an insulating substrate 3 a via an electrode or an electrode film 4 . On one side of the circuit board 2, output electrodes 2b connected to the motherboard 100 of electronic equipment such as a mobile phone on which the ECM is mounted are provided, and electronic components 11 such as integrated circuits are provided on the other side via the connection electrodes 2a. , 12. The spacer ...

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Abstract

The invention provides ECM for thinning the electronic device to mount ECM, comprising a circuit base plate (2), spacers (8; 8, 9), a vibrating film (7) and a shielding case (85) of a cup form for covering thereof overlapped in turn. A sound hole (10a) for perforating the spacers is formed from the outer side of the circuit base plate (2), also a space communicating between end walls of the vibrating film and the shielding case, and an outer part of an electret capacitor microphone.

Description

[0001] This application is based on and claims priority from prior Japanese Patent Application No. 2007-135635 filed on May 22, 2007, the entire contents of which are incorporated herein by reference. technical field [0002] The invention relates to an electret condenser microphone. Background technique [0003] In recent years, electret condenser microphones (Electret Condenser Microphone, hereinafter abbreviated as ECM) have been widely used as small high-performance microphones widely used in electronic equipment such as mobile phones, video cameras, and digital cameras. Electronic equipment is required to be miniaturized and thinned, and an electret condenser microphone mounted in the electronic equipment needs to meet such requirements. [0004] JP 2003-78997 discloses as Figure 8 ECM80 shown. This ECM is configured by sequentially stacking a circuit board 2, a first spacer 8, an electret substrate 3, a second spacer 9, and a diaphragm unit 6 having a conductive supp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/01H04R19/04H04R1/02
CPCH04R19/016
Inventor 土屋裕纪小林和裕
Owner CITIZEN ELECTRONICS CO LTD