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Heat radiator

A technology of heat sink and heat dissipation medium, which is applied in semiconductor devices, electric solid state devices, and semiconductor/solid state device parts, etc. The effect of low cost and efficient heat dissipation

Active Publication Date: 2011-03-02
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing problems are: first, the heat pipe is made of copper, which has a high cost; second, the aluminum sheet cannot be completely attached to the heat pipe after being embedded in the heat pipe, which seriously reduces the heat conduction efficiency

Method used

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Embodiment Construction

[0019] Specific embodiments of the present invention will be described below in conjunction with the accompanying drawings. But the invention can be embodied in many different ways as defined and covered by the claims. The same components are denoted by the same reference numerals in the drawings.

[0020] figure 1 A longitudinal sectional view of the heat sink 1 of the present invention is shown in . from figure 1 It can be seen from the figure that the radiator 1 includes aluminum sheets 3, 3' as end caps and an aluminum sheet stack 2 with holes as the radiator body 1, and the aluminum sheets 3, 3' are respectively arranged on the sides of the stack. On both sides, of course, the number of aluminum sheets 3, 3' can also be greater than one. The radiator body 2 between the aluminum sheets 3, 3' comprises a plurality of aluminum sheets provided with openings, and the design of each aluminum sheet and the mode of forming the cavity are illustrated with the aluminum sheets 4...

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PUM

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Abstract

A radiator comprises closing parts (3, 3') and a main body (2), wherein the closing parts (3, 3') is used for seal the main body (2), characterized in that, a plurality of metal sheets (4, 5, 6) are stacked to compose a piling body (2) as the main body, at least an opening (7. 7', 7''; 8, 8', 8''; 9, 9', 9'') are arranged on the plurality of metal sheets (4, 5, 6), each opening (7) and each corresponding openings (8, 9) piled on the metal sheets form into at least sealing cavities (11, 12, 13), and heat emission media (10) are housed in at least one cavity (11, 12, 13). The invention realizesconduction cavity with heat pipe efficacy in low cost. In addition, the number and the shape of conduction cavities are adjusted through simply adjusting the number and the position of the opening onthe metal sheets, thereby better satisfying different heat emission requirement.

Description

technical field [0001] The invention relates to a radiator, in particular to a radiator for dissipating heat from a CPU. Background technique [0002] The heat pipe technology is currently widely used in the heat dissipation of the CPU. Its principle is to use evaporative refrigeration. One end of the heat pipe is the evaporation end, and the other end is the condensation end. When one end of the heat pipe is heated, the liquid in the capillary evaporates rapidly, and the steam flows to the other end under a small pressure difference, and releases energy to condense into a liquid again. The material flows back to the evaporation section by capillary force, and the cycle is endless. Since this cycle is rapid, heat can be continuously conducted away. [0003] CN2823961 discloses a heat pipe radiator, wherein a copper heat pipe is used, and several layers of aluminum heat sinks are embedded on the copper heat pipe. The existing problems are: first, the heat pipe is made of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/473
Inventor 陈川
Owner LENOVO (BEIJING) LTD
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