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Welding tray for welding gold brick/gold finger/touch tablet

A gold finger and soldering pad technology, applied in the field of soldering pads, can solve the problems of easy tinning, defective products, affecting appearance and use, etc., and achieve the effect of not easy to skew, less defective products, and easy assembly

Active Publication Date: 2009-01-07
深圳市欣威智能有限公司
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  • Summary
  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned shortcomings in the prior art when welding metal sheets and contact sheets, the surface of the metal sheet and contact sheets is easy to be tinned, which affects appearance and use, and easily causes defects such as defective products. A pad composed of independent parts, the outer contour of the pad matches the outer contour of the metal sheet and the contact sheet, and the outer contour of the pad is 0.15MM smaller than the outer contour of the hardware sheet and the contact sheet

Method used

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  • Welding tray for welding gold brick/gold finger/touch tablet

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Embodiment Construction

[0016] This embodiment is a preferred implementation mode of the present invention, and other principles and basic structures that are the same or similar to this embodiment are within the protection scope of the present invention.

[0017] Please see attached figure 1 , the pad of the present invention mainly includes two parts, that is, the first pad part 3 and the second pad part 4. In this embodiment, the first soldering part 3 and the second soldering part 4 are arranged side by side, and the two soldering parts Form a rectangular pad, the insulating part between the first welding part 3 and the second welding part 4 can be blank or can be provided with insulating media such as green oil, black oil or red oil, and the two welding parts can be connected to the circuit board at the same time The circuit connection in, also can make one of them connect with the circuit in the circuit board. When soldering gold bricks / gold fingers / contacts, after the solder paste is printed ...

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Abstract

The invention discloses a welding disc used for welding golden bricks, golden fingers or bump pieces, etc. The welding disc comprises two parts which are arranged in line and mutually independent; the whole profile of the two parts is coincident to the external profile of the golden bricks / golden fingers / bump pieces. When the welding disc of the invention is adopted, the hardware pieces and bump pieces are not easy to be inclined and the finished product is easy to be assembled during the welding production of SMT. When the welding disc of the invention is adopted, the surface of the hardware is not plated by Sn, the appearance is affected little, the surface of the bump piece is not easy to be plated by Sn, the spot-welding is affected little, and the finished product has little defective products and high production efficiency.

Description

Technical field [0001] The invention discloses a welding pad, in particular to a welding pad used for welding gold bricks, gold fingers or bumps and the like. Background technique [0002] At present, in the vast majority of electronic products, when soldering components, it is inevitable to encounter some solder pads such as hardware chips (gold bricks / golden fingers) and touch pads on the PCB. Especially in lithium batteries such as mobile phone batteries and digital camera batteries, gold fingers are used for the conductive terminals. In the prior art, the welding of gold fingers / gold bricks / touch pieces is mostly a traditional process. The pad itself is a whole, and its shape is divided into two types: rectangle and square. The size of the pad on the PCB board is related to the attached component ( Gold fingers / gold bricks / touch pads) have a size ratio of 1:1 (that is, the same size). When the pads in the traditional process are reflow soldered, there are the following...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11H01M50/503H01M50/516
CPCY02E60/10
Inventor 左其国
Owner 深圳市欣威智能有限公司
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