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Method for producing double interfaces smart card, double interfaces smart card and antennae layer thereof

The technology of a dual-interface smart card and production method is applied in the directions of antenna supports/installation devices, layered products, and record carriers used by machines, which can solve the problems of low productivity and high scrap rate of dual-interface smart cards, and achieve machine automation, Avoid the effects of manual manipulation

Active Publication Date: 2009-01-21
BEIJING WATCH DATA SYST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] The invention provides a production method of a dual-interface smart card, which can solve the problems of low productivity and high rejection rate of the current dual-interface smart card

Method used

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  • Method for producing double interfaces smart card, double interfaces smart card and antennae layer thereof
  • Method for producing double interfaces smart card, double interfaces smart card and antennae layer thereof
  • Method for producing double interfaces smart card, double interfaces smart card and antennae layer thereof

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Embodiment Construction

[0035] The invention aims to provide a production method of a dual-interface smart card, a dual-interface smart card and an antenna layer thereof, which can improve the production efficiency of the dual-interface smart card and reduce the reject rate of the dual-interface smart card. Embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be clear that the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0036] Such as figure 1 As shown, the production method of the dual-interface smart card in the embodiment of the present invention comprises steps:

[0037] S100, making a chip circuit layer including an antenna stock layer with a through hole and an ...

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Abstract

The invention discloses a method for producing a dual-interface card, the dual-interface card and an antenna layer of the dual-interface card, which relate to the smart card manufacture field and are designed for improving the production efficiency of the dual-interface card and for lowering the reject rate of the dual-interface card. The method for producing the dual-interface card comprises: manufacturing an antenna feed preparation layer which comprises through holes, an antenna which is arranged on the antenna feed preparation layer and a chip circuit layer of a dual-interface module, wherein the antenna is electrically connected with the dual-interface module on the through holes, respectively placing a front layer and a back layer on the front and the back of the chip circuit layer, and laminating to obtain the dual-interface card. The antenna layer of the dual-interface card of the invention comprises the antenna feed preparation layer which comprises the through holes and an antenna which is arranged on the antenna feed preparation layer, wherein aerial heads of the antenna are arranged in the through holes and areas which are corresponding to an antenna solder joint of a prearranged dual-interface module.

Description

technical field [0001] The invention relates to the field of smart card manufacturing, in particular to a dual-interface smart card. Background technique [0002] DI (Dual Interface) card is the abbreviation of dual interface smart card. The DI card is made of PVC laminated chips and coils. It is based on a single chip and integrates contact and non-contact interfaces. The DI card has two operation interfaces, which can be used to access the chip through the contact point or the radio frequency method at a certain distance (within 10cm) to perform the same operation. The two interfaces follow two different standards respectively, the contact interface conforms to ISO / IEC 7816; the non-contact interface conforms to ISO / IEC 14443. These two interfaces share the same microprocessor, operating system and EEPROM (electrically erasable programmable read-only memory). In addition to a microprocessor chip, the DI card also has an antenna coil connected to the microprocessor. When...

Claims

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Application Information

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IPC IPC(8): G06K19/077H01Q1/22B32B5/00
Inventor 李巍
Owner BEIJING WATCH DATA SYST
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