Method for producing double interfaces smart card, double interfaces smart card and antennae layer thereof

The technology of a dual-interface smart card and production method is applied in the directions of antenna supports/installation devices, layered products, and record carriers used by machines, which can solve the problems of low productivity and high scrap rate of dual-interface smart cards, and achieve machine automation, Avoid the effects of manual manipulation
CN101350073AActive Publication Date: 2009-01-21BEIJING WATCH DATA SYST
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
BEIJING WATCH DATA SYST
Publication Date
2009-01-21

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Abstract

The invention discloses a method for producing a dual-interface card, the dual-interface card and an antenna layer of the dual-interface card, which relate to the smart card manufacture field and are designed for improving the production efficiency of the dual-interface card and for lowering the reject rate of the dual-interface card. The method for producing the dual-interface card comprises: manufacturing an antenna feed preparation layer which comprises through holes, an antenna which is arranged on the antenna feed preparation layer and a chip circuit layer of a dual-interface module, wherein the antenna is electrically connected with the dual-interface module on the through holes, respectively placing a front layer and a back layer on the front and the back of the chip circuit layer, and laminating to obtain the dual-interface card. The antenna layer of the dual-interface card of the invention comprises the antenna feed preparation layer which comprises the through holes and an antenna which is arranged on the antenna feed preparation layer, wherein aerial heads of the antenna are arranged in the through holes and areas which are corresponding to an antenna solder joint of a prearranged dual-interface module.
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Description

technical field

[0001] The invention relates to the field of smart card manufacturing, in particular to a dual-interface smart card. Background technique

[0002] DI (Dual Interface) card is the abbreviation of dual interface smart card. The DI card is made of PVC laminated chips and coils. It is based on a single chip and integrates contact and non-contact interfaces. The DI card has two operation interfaces, which can be used to access the chip through the contact point or the radio frequency method at a certain distance (within 10cm) to perform the same operation. The two interfaces follow two different standards respectively, the contact interface conforms to ISO / IEC 7816; the non-contact interface conforms to ISO / IEC 14443. These two interfaces share the same microprocessor, operating system and EEPROM (electrically erasable programmable read-only memory). In addition to a microprocessor chip, the DI card also has an antenna coil connected to the microprocessor. When...

Claims

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