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Smart blister pack

A technology of blister packaging, non-conductive layer, applied in the field of security labels

Inactive Publication Date: 2009-01-28
CHECKPOINT SYST INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Applying such EAS or RFID security labels to pharmaceutical blister packaging is challenging due to the structure of the blister packaging

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0031] figure 2 An isometric view of a smart blister pack 20 of the present invention is provided. However, until smart blister packs 20 are discussed in detail, typical blister packs 10 (see figure 1 ) structure will be discussed. As is well known, a blister pack 10 includes a non-conductive layer (e.g., polystyrene) 12 that includes a cavity 14 (FIG. 6) for holding individual contents 15, such as pills. , tablets, capsules, etc. Thereafter the aluminum layer 16 is heat sealed over the non-conductive layer 12, thereby sealing the contents 15 therein. In order to remove one of the contents 15, the user need only apply sufficient pressure on the particular cavity 14 (FIG. 6) to rupture the aluminum layer 16 directly above the cavity 14, and thereafter the contents 15 are exposed and ready Used or ingested by users.

[0032] The method of the present invention utilizes the portion 16A of the aluminum layer 16 surrounding the array of cavities 14 . In the present invention,...

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PUM

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Abstract

A blister pack having at least one security tag formed from the metal layer of the blister pack. In one embodiment, the security tag is a detached portion of the metal layer that is entrenched in a corresponding channel in the plastic layer of the blister pack and which is then completed by electrically coupling a capacitor strap or chip strap to a gapped portion of the entrenched aluminum layer. Another embodiment also forms the security tag from the metal layer but the coil or antenna of the security tag is formed as part of the process of sealing the metal layer to the plastic layer. A capacitor strap or chip strap is then electrically coupled to a gapped portion of trie coil or antenna.

Description

[0001] Cross-Referenced Related Applications [0002] The application text of the present invention requires a filing date of November 14, 2005 under 35 U.S.C. § 119(e), U.S. Provisional Patent No. 60 / 736,532 entitled "Smart Blister Packaging" application, and its entire disclosure is hereby incorporated by reference. technical field [0003] The present invention relates to security labels and, more particularly, discloses a blister pack that includes an EAS or RFID coil or antenna as part of a metal layer seal and to which a capacitive strap or chip strap can be electrically coupled to Form EAS or RFID security tags. Background technique [0004] Monitoring or detecting the presence or removal of retail items on or from shelves or the completion of the retail process occurs at the area of ​​Electronic Article Surveillance (EAS), which now also includes Radio Frequency Identification (RFID). EAS or RFID detection is typically obtained by applying EAS or RFID security tag...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F3/03E05B73/00
CPCG08B13/2445G08B13/2414
Inventor 安卓尔·扣特
Owner CHECKPOINT SYST INC