Communication negotiation method, system of physical layer chip and a physical layer chip thereof

A technology of physical layer chips and communication capabilities, applied in transmission systems, digital transmission systems, data exchange details, etc., can solve problems such as inflexibility and inability to guarantee the communication capabilities of LREPHY chips and ordinary PHY chips, so as to achieve simple implementation and reduce implementation cost effect

Inactive Publication Date: 2009-02-04
NEW H3C TECH CO LTD
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  • Abstract
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Problems solved by technology

But this way is obviously not flexible enough
If the LRE PHY chip and the common PHY adopt the self-negotiation mode respectively, since the LRE PHY chip and the normal PHY neg

Method used

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  • Communication negotiation method, system of physical layer chip and a physical layer chip thereof
  • Communication negotiation method, system of physical layer chip and a physical layer chip thereof
  • Communication negotiation method, system of physical layer chip and a physical layer chip thereof

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Embodiment Construction

[0046] The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0047] The present invention is a communication capability negotiation scheme of a physical layer chip, which is applicable to a network device having a first physical layer chip and a second physical layer chip. Notifying the second physical layer chip of the communication capability determined through negotiation; the second physical layer chip uses the obtained communication capability to negotiate the communication capability with its peer in a fixed negotiation mode.

[0048] The negotiation scheme can be applied to a system composed of the above-mentioned network device and two peers connected to the network device. The network device needs to negotiate the communication capability of the physical layer with two peers. Since the network device includes two physical layer chips and is connected to the two peers respectively, the two physical layer chi...

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Abstract

The invention discloses a communication capacity negotiation method of physical layer chips, which is applied to a network equipment provided with a first physical layer chip and a second physical layer chip, and the method comprises: the first physical layer chip negotiates the communication capacity with an opposite end of itself, and notifies the confirmed communication capacity under negotiation to the second physical layer chip; and the second physical layer chip adopts the acquired communication capacity to negotiate the communication capacity with an opposite end of itself by a fixed negotiation mode. The invention discloses a communication capacity negotiation system of physical layer chips as well as physical layer chips. The invention can ensure the two physical layer chips to acquire the same communication capacity after the negotiations.

Description

technical field [0001] The invention relates to communication capability negotiation technology in the communication field, in particular to a communication capability negotiation method of a physical layer chip, a communication capability negotiation system of a physical layer chip and a physical layer chip. Background technique [0002] Two communication devices need to negotiate the communication capability of the physical layer before communication, and the communication capability includes communication rate and communication mode. Wherein, the communication rate includes 10Mbps, 100Mbps, and 1000Mbps, and the communication mode includes half-duplex, full-duplex and other communication modes. After negotiation, it can be negotiated into 10Mbps half-duplex, 100Mbps full-duplex and so on. The communication capability negotiation of the physical layer is performed between the physical layers of the communicating parties. [0003] For long-distance Ethernet devices, the n...

Claims

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Application Information

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IPC IPC(8): H04L29/06H04L12/02
CPCH04L5/1446H04L69/24H04L69/18H04L69/323
Inventor 于洋
Owner NEW H3C TECH CO LTD
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