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Temperature estimation method and device

A technology of an estimated value and an estimating unit, which is applied in the following fields of temperature estimation methods and devices, can solve the problem that the temperature cannot be directly measured, and achieve the effect of reducing the amount of calculation

Active Publication Date: 2009-02-04
YAMATAKE HONEYWELL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The present invention was made in order to solve the above problems. The first object is to provide a temperature estimation method and device, even when the temperature of the estimated object cannot be directly measured, and between the estimated object and the temperature measurable point during heating and cooling processes Even when the thermal resistance changes, the temperature of the estimation target can be estimated with high accuracy and quickly through simple calculation processing

Method used

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Examples

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Embodiment 1

[0034] figure 1 The structure of the heating-cooling processing apparatus of Example 1 of this invention is shown. exist figure 1 Among them, 2 is the heating plate carrying the workpiece 1, 3 is the heater installed on the heating plate 2, 4 is the temperature sensor installed on the heater 3, 5 is the controller, and 6 is the ambient temperature sensor. The controller 5 has a temperature estimation device 50 and a control device 51 . The controller 5 can be realized by a computer having a CPU, a storage device, and an interface, and a program for controlling these hardware resources. The CPU executes the following processing according to the program stored in the storage device.

[0035] Hereinafter, the principle of temperature estimation by the temperature estimation device 50 will be described. Let the temperature of the heater 3 be T h , the temperature of workpiece 1 to be estimated is T w , the ambient temperature is T e , the output value of the controller outp...

Embodiment 2

[0111] Next, Example 2 of the present invention will be described. In this embodiment, since the structure of the heating and cooling treatment device is the same as that of Embodiment 1, usefigure 1 symbols are explained.

[0112] First, the principle of temperature estimation by the temperature estimation device 50 of this embodiment will be described. When against the heater temperature T h and workpiece temperature T w , according to the heat conduction model about the temperature measurable point (heater 3) and the estimated object (workpiece 1), the formula is established, after discretization and sorting, the workpiece temperature T at time n+1 w (n+1) becomes the above formula (1), the heater temperature T at time n+1 h (n+1) becomes the above-mentioned formula (2).

[0113] Assume that in actual operation, the heat capacity value of the workpiece 1 to be estimated varies from workpiece to workpiece. Let the heat capacity change coefficient of heat capacity value ...

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Abstract

A temperature estimation device (50) includes: a storage unit for storing a parameter of a thermal transfer model concerning a heater (3) and a work (1); a temperature measuring unit for measuring the temperature of the heater (3); a work temperature change amount estimation unit for estimating a true value of the work temperature change amount according to a temperature change amount of the heater (3) obtained from the temperature of the heater (3), a temporarily estimated value of the heater temperature change amount as a value obtained by estimating the temperature change amount of the heater (3) according to the thermal transfer model, and a temporarily estimated value of a work temperature change amount as a value obtained by estimating the temperature change amount of the work (1) according to the thermal transfer model; and a work temperature estimation unit for estimating the true value of the work temperature from the true value of the estimated work temperature change amount.

Description

technical field [0001] The present invention relates to heating and cooling processing equipment such as semiconductor manufacturing equipment, and more particularly to a temperature estimation method and device for estimating the temperature of an estimation object based on the temperature of a temperature measurement possible point such as a heater having thermal resistance between the estimation object and the like. Background technique [0002] When it is impossible to actually measure the temperature of the object to be heated and cooled (wafer in the case of a semiconductor manufacturing device) during operation such as a semiconductor manufacturing device, it is often performed as follows, that is, during trial operation and adjustment of the device A temperature sensor is installed on the object to be heated and cooled, and a model of the heating and cooling processing unit and the object to be heated and cooled is created. During actual operation, the temperature of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01K7/00H01L21/205
CPCG01K7/42
Inventor 大野忠久本桥勇人
Owner YAMATAKE HONEYWELL CO LTD