Substrate cleaning apparatus

A technology for cleaning equipment and substrates, applied in cleaning methods and utensils, cleaning methods using liquids, electrical components, etc., can solve the problem of pure water turning into droplets or mist, etc., and achieve the effect of preventing backflow pollution
CN101414549AActive Publication Date: 2009-04-22EBARA CORP

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
EBARA CORP
Publication Date
2009-04-22

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

A substrate cleaning apparatus is used to clean a substrate with a cleaning liquid. The substrate cleaning apparatus includes a substrate holding mechanism configured to hold a substrate horizontally, a rotating mechanism configured to rotate the substrate held by the substrate holding mechanism, a liquid supply nozzle for supplying a cleaning solution to the substrate, and a spin cover provided around the substrate and rotatable at substantially the same speed as the substrate. The spin cover has an inner circumferential surface shaped so as to surround the substrate. The inner circumferential surface is, from a lower end to an upper end thereof, inclined radially inwardly.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a substrate cleaning apparatus for cleaning a substrate by supplying a cleaning liquid such as pure water or a chemical solution to the substrate and drying the cleaned substrate. Background technique

[0002] In the process of manufacturing semiconductor devices, cleaning of substrates is an important process for improving product yield. Such a substrate cleaning process is performed, for example, after a substrate polishing process to remove excess debris from the substrate. in the attached picture Figure 28 and 29 An example of a substrate cleaning apparatus is shown. Such as Figure 28 and 29 As shown, the substrate cleaning apparatus has a substrate holding mechanism 100 arranged to hold a substrate W; a motor 101 arranged to rotate the substrate holding mechanism 100; a fixed cover 102 arranged around the substrate W; and a nozzle 103 for supplying pure water as a cleaning liquid onto the surface of the subst...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More