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Enhancement type anti-corrosion composite conductive grounding device

A composite conductive and grounding device technology, applied in anti-corrosion coatings, carbon-silicon compound conductors, connecting contact materials, etc., to achieve the effect of large contact surface, convenient construction and good electrical conductivity

Active Publication Date: 2010-07-07
江苏科兴电器有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In traditional grounding devices, the grounding wire is usually directly welded to the grounding body or connected to the grounding body via bolts. The welded part is prone to corrosion. Even if it is coated with an anti-corrosion layer, direct welding of the grounding wire will destroy the anti-corrosion layer during construction. The anti-corrosion layer loses its protective effect, which reduces the service life and conductivity of the grounding device; the grounding wire is connected by bolt locking, and the locking part is easy to loosen, which cannot effectively protect the electrical equipment. The connection is not firm, the contact surface is small, the resistance is large, and the electrical conductivity Poor performance and short service life
Patent No. 20061009890.8 discloses a surface treatment method of electroless nickel plating on steel grounding electrodes. It is nickel-plated on the surface of the grounding body. After a long time in the ground, the grounding body is prone to peeling, poor adhesion, and easy to corrode. The cost of nickel plating is relatively high. High; Patent No. 200510021757.X discloses a method of manufacturing zinc-clad steel grounding electrodes, which uses zinc-clad steel and presses it onto the steel core through a hydraulic press, but there is a gap between the zinc layer and the steel layer, and the conductive effect is not good , easy to peel off the layer, the anti-corrosion effect is not good, the service life is short, and the processing is cumbersome
An existing grounding body uses a layer of nano-carbon layer directly sprayed on the surface of the angle steel grounding body under high pressure. During the construction process, the surface of the grounding body is prone to friction, impact, and strain, so that the nano-carbon layer is worn, and the angle steel base material is exposed at the worn part, avoiding No rust corrosion and diffusion corrosion at the rusted place, the anti-corrosion effect is not ideal, affects the electrical conductivity, and the protective performance has not been fundamentally improved

Method used

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  • Enhancement type anti-corrosion composite conductive grounding device
  • Enhancement type anti-corrosion composite conductive grounding device

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Embodiment Construction

[0012] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0013] figure 1 As shown, the "L"-shaped connecting wire 2 is welded on the grounding body 1. The "L"-shaped short side of the connecting wire is welded on the grounding body 1. The welding surface is large, the welding is firm, and the electrical conductivity is good. The "L" of the connecting wire The long side of the shape is perpendicular to the grounding body 1, and is locked and connected to the grounding wire 4 through the installation joint 3, and the grounding wire 4 can be connected to the connecting wire 2 horizontally or vertically through the installation joint 3. During processing, the bottom end of the grounding body 1 is processed into a pointed cone shape, and the grounding body 1, connecting wire 2, installation joint 3, and grounding wire 4 are hot-dip zinc protective layer 5 respectively, and then a composite anti-corrosion...

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Abstract

The invention provides an enhanced anticorrosive complex conductive grounding device which comprises a grounding body and a grounding wire, and the enhanced anticorrosive complex conductive grounding device also comprises a connecting wire and an installation joint, wherein a right-angle hem of the connecting wire is welded on one face of an angle iron or the outer wall of a column of the grounding body; the connecting wire tightly locks and is connected with the grounding wire through the installation joint; the surfaces of the grounding body, the grounding wire, the connecting wire and the installation joint are all provided with hot-dip zinc layers; and a layer of complex anticorrosive layer composed of nano-carbon and nano-silver conductive materials is also coated on the hot-dip zinclayer. When the invention is installed, the grounding wire is tightly locked and connected with the connecting wire welded on the grounding body by directly installing a joint, welding operation doesnot need at the scene, the anticorrosive layer is not damaged, the construction is convenient, the processing is convenient, the production cost is low, the anticorrosive performance is good, and theconductive performance and the use life of the grounding device are enhanced.

Description

Technical field [0001] The present invention involves a safe grounding device, which is specifically a enhanced anti -corrosion composite conductive ground device for large and medium -sized enterprises such as electricity, chemical industry. Background technique [0002] The grounding device is composed of the metal ground body buried in the soil (corner steel, flat steel, steel pipe, etc.) and the ground wire for connected.The traditional grounding device is generally welded directly on the ground body or connected to the ground body through bolts. The welding site is easy to rust. Even if the coating has an anti -corrosion layer, the ground wire will be directly welded.The anticorrosive layer loses the protection effect and reduces the service life and conductive performance of the grounding device; the method of locking the ground wire is used to lock the ground line.Poor performance and short service life.The patent number 20061009890.8 Popularly disclosed the surface treat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R4/66H01B1/04C09D5/08
Inventor 赵维民
Owner 江苏科兴电器有限公司