Probe, test socket and tester thereof

Abstract

The invention relates to a probe which is installed on a test jack or a test machine so as to carry out the high frequency test of an integrated circuit module, wherein the probe is an electrical conductor, one end of the probe is used for touching the integrated circuit module which needs to be tested, and the other end of the probe is used for touching a load baseplate. The probe extends on a first plane so as to form a body part, wherein the inertia moment of the probe is larger than any inertia moment on the first plane in any direction, and the first direction is the normal direction of the normal line of the first plane. The body part which is adjacent to the center thereof extends horizontally to form at least one first elastic part, and the elastic coefficient of the body part is higher than that of the first elastic part, so that the elastic deformation amount of the body part is less than that of the first elastic part under the same strained condition.

Description

Technical field [0001] The present invention relates to a probe, especially installed in a test socket, for testing integrated circuit components. Background technique [0002] In the well-known technology for high-frequency testing of integrated circuit components, in order to improve the performance of the probe, most of the focus is on improving the flexibility of the internal components of the probe, so as to improve the performance of the probe, so that the component under test will not be easily damaged. For example: US published patents US6046597, US7102369, US6791345, US6859504, and US5634801. In each of the aforementioned known technologies, improvements are made to the inside of the probe by forming an elastic probe with a spring, or bending the elastic probe into a spring shape, or adding a polymer elastomer (elastomer) to the probe. The elastic probe is formed to avoid direct damage to the component to be tested. However, during high-frequency testing, the test envir...

AI Technical Summary

Problems solved by technology

In each of the aforementioned known technologies, improvements are made inside the probe, by forming an elastic probe with a spring, or bending the elastic probe into a spring shape, or adding a polymer elastomer (elastomer) to the probe. Elastic probes are formed to avoid direct damage to the components under test. However, when performing high-frequency tests, the test environment is often a preset high temperature or low temperature. Due to the structure of the spring probe, the probe will inevitably cause damage to the contact end The high impedance is too high, and the probes equipped with elastomers are likely to lose the elasticity of polymer elastomers due to the strong influence of high temperature and low temperature environments, thus reducing the service life and performance of the probes

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