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Low-profile board level emi shielding and thermal management apparatus and spring clips for use therewith

A spring clip, low profile technology for magnetic field/electric field shielding, cooling/ventilation/heating retrofit, semiconductor/solid-state device components, etc., which can solve problems such as product life and reliability reduction

Inactive Publication Date: 2011-09-07
TIANJIN LAIRD TECH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Excessive heat buildup can lead to reduced product life and reliability

Method used

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  • Low-profile board level emi shielding and thermal management apparatus and spring clips for use therewith
  • Low-profile board level emi shielding and thermal management apparatus and spring clips for use therewith
  • Low-profile board level emi shielding and thermal management apparatus and spring clips for use therewith

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Embodiment Construction

[0025] The following description is merely exemplary in nature, and is in no way intended to limit the present disclosure, application or use.

[0026] According to various aspects of the present disclosure, there are provided exemplary embodiments of low-profile devices capable of providing board-level EMI shielding and dissipating heat generated by one or more electrical components of the board. Other aspects involve low-profile board-level EMI shielding and thermal management components. A further aspect involves the use of low-profile board-level EMI shielding and thermal management components. Additional aspects relate to methods of manufacturing low-profile board-level EMI shielding and thermal management components, and methods of manufacturing their components.

[0027] In various embodiments, the device typically includes a board-level EMI shielding gasket (e.g., conductive elastomer, etc.) for electrically grounding the device to a board (e.g., printed circuit board, etc...

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PUM

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Abstract

According to various aspects of the present disclosure, exemplary embodiments are provided of low-profile apparatus capable of providing board level shielding for one or more electrical components while also providing dissipation of heat generated by the one or more electrical components. In one particular embodiment, an apparatus generally includes a resiliently compressible EMI gasket, a heat sink, and a spring clip. The spring clip has resilient legs with feet. The feet are configured to engage the board. When the feet are engaged with the board, a clamping force is generated that compressively biases the heat sink and the resiliently compressive EMI gasket generally towards the board.

Description

Technical field [0001] The present disclosure generally (but not exclusively) relates to low-profile devices that contain spring clips and are capable of providing board-level EMI shielding and dissipating heat generated by one or more electrical components of the board. Background technique [0002] The description in this part only provides background information related to the present disclosure and may not constitute prior art. [0003] Electronic equipment includes electrical components and circuits that are installed or supported on a substrate and may be sensitive to electromagnetic interference (EMI) and radio frequency interference (RFI). Such EMI / RFI interference can originate from internal sources in the electronic device and / or external EMI / RFI interference sources. Interference may cause attenuation or complete loss of important signals, making electronic equipment inefficient or ineffective. Therefore, circuits (sometimes referred to as RF modules or transceiver cir...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K9/00
CPCH01L2924/0002H01L23/4093H01L2924/3011H05K9/0032H01L23/552H01L2924/00H05K7/20H05K9/00
Inventor 肯尼思·M·罗宾逊詹姆斯·E·克兰
Owner TIANJIN LAIRD TECH LTD
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