Lifter structure

Abstract

The invention relates to a magazine accurate movement technique during the production of a semiconductor wafer, in particular to a raiser structure for accurately positioning wafers in a magazine, solving the problem that after production, a wafer cannot be correctly sent back to the original magazine from which the wafer is fetched. The raiser structure is provided with a magazine placing and fixing device, a servo control system and laser sensors. The magazine placing and fixing device is connected with the servo control system driving the magazine placing and fixing device to ascend and descend, and the laser sensors are corresponding to the wafers in the magazine. The magazine placing and fixing device, the laser sensor, the servo control system and the laser sensor are respectively arranged on the frame which is provided with a photoelectric sensor to control a servo system. The invention has the advantages of simple and reliable structure, down cost, high control accuracy, stable movement, etc.

Description

technical field [0001] The invention relates to the precise movement technology of the chip box in the process of semiconductor wafer processing, in particular to a lifter structure for accurately positioning the wafer in the chip box. Background technique [0002] During the processing of semiconductor wafers, it is necessary to precisely position the wafers in the cassette so that the manipulator can accurately pick up and deliver the wafers. Most of the current semiconductor equipment is equipped with two sets of lifters, which are used to take and send chips respectively. Moreover, the current lifter simply moves along a certain direction, and does not position the wafers in the cassette during the movement. This makes it impossible to confirm whether or not a wafer is present in the cassette, nor to confirm the exact position of the wafer. Therefore, the wafer cannot be accurately sent back to the original film pickup box after the processing is completed, but can on...

AI Technical Summary

Problems solved by technology

[0003] In order to overcome the above-mentioned deficiencies, the purpose of the present invention is to provide a lifter structure that satisfies the high-precision control requirements of semiconductor wafer processing for the cassette, and solves the problem of In the future, it cannot be accurately sent back to the original film pickup box, etc.

Images