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Immersed LEDs

An LED array and LED packaging technology, applied in lighting and heating equipment, semiconductor devices of light-emitting elements, display devices, etc., can solve the problems of low luminous efficiency, unconstrained sparkle, unacceptable performance, etc., to improve luminous efficiency , to avoid the effect of total internal reflection

Active Publication Date: 2011-07-06
SIGNIFY HLDG BV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] For LEDs fully immersed in a glass-like medium, the problem is total internal reflection (TIR) ​​at the interface between the glass surface and the surrounding air
However, when LEDs reach a relatively high density (such as >0.5cm -2 ), totally reflected light will scatter at adjacent packages, resulting in unpredictable light outcoupling
[0004] When LED systems (as described above) are used for lighting, their performance is unacceptable due to the low luminous efficiency and unconstrained flare; that is, we cannot prevent the LED array system from emitting light in undesired directions

Method used

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Examples

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Embodiment Construction

[0025] figure 1 A part of a system 2 is shown schematically, in which a Lambertian LED 4 is arranged on a glass plate substrate 6 . On the substrate 6 is a transparent conductor 8 that supplies current to the LED 4 . The LED 4 is sandwiched between the substrate 6 and the glass top plate 10, and is immersed in a polymer 12, typically polyvinyl butyral (PVB), which also provides for holding the glass plates 6 and 10 in place. cohesion together. The refractive index of PVB is close to that of glass, and it is set to 1.5 in the calculations described below. The approximate height H of the sandwich system is generally about 7-8 mm. The system is generally surrounded by air 14 . Arrow A represents the light emitted by LED4, and arrow A' represents light through total internal reflection.

[0026] The luminous efficiency η (ie, the amount of light emitted from the glass top plate 10 divided by the total amount of light emitted by the LED 4 ) of the above system is relatively lo...

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Abstract

The present invention relates to a LED-array system (202) comprising at least one LED package (200), said at least one LED package comprising a LED (204) and being arranged on a substrate (206) provided with means (208) for supplying the LED package (200) with a drive voltage, wherein said at least one LED package is immersed in a supporting layer (212) covering the substrate plate (206). In order to improve optical efficiency and reduce glare the LED package also comprises a reflector (220) having a reflective surface for collimating the light emitted by the LED (204). The invention also relates to lighting systems comprising the LED-array system and a method for producing said LED-array system.

Description

technical field [0001] The present invention relates to light emitting diodes incorporated into glass-like materials. Background technique [0002] Light emitting diodes (LEDs) incorporated into glass are currently used to construct light radiating elements. In these components, a two-dimensional array of light-emitting diodes is sandwiched between two glass plates laminated from a polymer, typically PVB (polyvinyl butyral). The LEDs are mounted on a glass plate that has a pattern of conductors that supply it with electrical current. The advantage of the above structure is that it has good durability, so that its application range is wider. [0003] For LEDs fully immersed in a glass-like medium, there is a problem with total internal reflection (TIR) ​​at the interface between the glass surface and the surrounding air. As a result, light rays incident at angles greater than the critical angle will all be reflected by the glass / air interface. However, total reflected lig...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21K7/00F21K99/00H01L33/60H01L33/62
CPCB32B17/10541Y10S362/80B32B17/10036F21V33/006F21K9/00H01L33/62F21Y2101/02B32B17/10761H01L33/60H01L2924/0002F21Y2115/10F21K9/68H01L2924/00
Inventor E·布恩坎普J·P·雅各布斯M·A·H·唐纳斯
Owner SIGNIFY HLDG BV
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